Staff Advanced Packaging/Process Engineer of R&D

Lumentum Operations LLC is seeking a Staff Advanced Packaging/Process Engineer for R&D to drive the development of cutting-edge packaging solutions for optical and photonic devices. This role involves innovating and optimizing processes for high-performance, reliable, and cost-effective packaging. What You'll Be Doing • Lead the design, development, and optimization of advanced packaging processes for new optical and photonic products, from concept to high-volume manufacturing. • Conduct hands-on process development, characterization, and troubleshooting for various packaging technologies, including die attach, wire bonding, flip-chip, optical alignment, hermetic sealing, and advanced interconnection schemes. • Develop and implement robust process control strategies, statistical process control (SPC), and design of experiments (DOE) to improve yield, reliability, and manufacturability. • Collaborate closely with cross-functional teams including design, product engineering, reliability, and manufacturing to ensure seamless transfer of new packaging technologies into production. • Evaluate and select new materials, equipment, and manufacturing techniques to enhance packaging performance, reduce cost, and improve throughput. • Perform root cause analysis for packaging-related failures and implement corrective actions. • Document process specifications, manufacturing instructions, and test procedures. • Mentor junior engineers and provide technical leadership within the R&D team. • Stay abreast of industry trends, emerging technologies, and competitive landscapes in advanced packaging. What We're Looking For Education: Master's or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related discipline. Experience: Core Requirements: • 8+ years of experience in advanced packaging or process engineering within the optoelectronics, photonics, or semiconductor industry, with a strong R&D focus. • Demonstrated expertise in multiple packaging technologies such as chip-on-board (COB), flip-chip, wafer-level packaging (WLP), system-in-package (SiP), hermetic sealing, and optical assembly. • Proficiency with various bonding techniques (e.g., wire bonding, thermocompression bonding, epoxy attach). • Strong understanding of materials science principles relevant to packaging, including adhesives, solders, encapsulants, and substrates. • Hands-on experience with packaging equipment, including pick-and-place, wire bonders, reflow ovens, and optical alignment systems. • Solid knowledge of statistical process control (SPC), design of experiments (DOE), and failure analysis techniques. • Experience with CAD tools for package design and simulation is a plus. • Excellent problem-solving, analytical, and communication skills. • Ability to work independently and collaboratively in a fast-paced R&D environment. Perks You'll Love • Flexible time off • Health and wellness benefits (physical and mental) • Tuition reimbursement and career growth support • A workplace built for you: free gym, games room, prayer room • Subsidized meals, free coffee/tea • Employee stock options and incentive plans • A collaborative, innovative, and inclusive culture Pay Range: P60-USA-1 :$112,050.00 - $160,050.00 Disclaimer: Final base salary for the successful candidate will depend on multiple factors, including but not limited to, job location, where work will be performed, qualifications, work history and relevant experience. With our continual goal of making Lumentum a best place to work for our employees, we strive to offer employees competitive total compensation packages, which may include annual bonus, commission for certain sales roles, equity, and health and welfare benefits.