About the RoleJoin our Corporate Research team in San Jose as an R&D Principal Engineer focused on developing novel materials and integration solutions for advanced semiconductor devices and 3D structures. In this role, you will work hands-on across materials synthesis, thin-film deposition, cleanroom fabrication, and advanced characterization to support next-generation IC technologies. You will collaborate with internal teams in San Jose and Taiwan, as well as university research partners, to explore new materials, devices, and thermal integration approaches for future semiconductor innovation.
You will join us in our San Jose office, operating on a hybrid work schedule with 4 days in-office.
Responsibilities- Research and develop novel materials and integration solutions for future devices and IC thermal management applications.
- Synthesize and deposit materials using CVD, ALD, PVD, and related techniques.
- Fabricate devices and test structures using cleanroom processes such as lithography, etching, deposition, metallization, and bonding.
- Characterize materials, interfaces, and devices using structural, chemical, electrical, optical, and thermal analysis methods.
- Analyze experimental data and prepare technical reports.
- Collaborate with internal cross-functional teams and external research partners.
- Conduct research at both in-house and off-site facilities.
Minimum Qualifications- Ph.D. in Physics, Materials Science, Chemistry, Electrical Engineering, or a related field.
- Experience in materials synthesis and thin-film deposition using CVD, ALD, PVD, or related growth methods.
- Hands-on experience with cleanroom processing, device fabrication, and characterization techniques.
- Strong knowledge of materials science, surface chemistry, thin-film growth, etching, planarization, and bonding.
- Ability to work independently and collaborate with cross-functional teams.
Preferred Qualifications- Experience in semiconductor device design, fabrication, integration, and advanced testing.
- Experience with thermal characterization of materials, structures, or interfaces.
- Experience setting up research equipment or programming for tool control and data collection.
- Experience in data analysis and technical reporting.
- Familiarity with physics-based simulation tools.
Pay Transparency / Benefits statementAt TSMC, your base pay is only part of your overall total compensation package. At the time of this posting, this role typically pays a base salary between $130,000 and $180,000 per year. The range displayed reflects the minimum and maximum target for new hires. Actual pay may be more or less than the posted range. Factors that influence pay include the individual's skills, qualifications, education, experience and the position level and location. TSMC's total compensation package consists of market competitive pay, allowances, bonuses, and comprehensive benefits. We also offer extensive development opportunities and programs.
Date: Oct 22, 2026
Country/Region: US
City: San Jose
Company: TSMC Technology, Inc.
