Memory Technology Roadmap and Strategy supporting the Varian Business Unit of the Silicon Products Group. The Varian Business Unit is responsible for developing solutions to address customer challenges in implant, patterning, packaging and photonics applications. The incumbent will play a key role in the organization serving both internal and external customers. This role encompasses several responsibilities including supporting the strategic planning processes for the business units, supporting market sizing, forecasting and analysis function, and constructing high-level messages and presentations for internal, corporate, and external audiences. Responsibilities • Understand industry technology roadmap as well as key path finding activities for next 10 years and implications to Applied • Work with a team of marketing, technical, and engineering professionals to identify key challenges for future memory technologies with focus on Memory and Advanced Packaging. • Understand technology inflections in Memory technology and translate to process equipment requirements. • Integrated demo and integration support to Business Units • Write and file IP to protect developed integration solutions. • Develop technical/ marketing collateral to promote Applied Materials solutions. • Gather data, analyze customer and competitor strategies to meet inflection needs, provide updates and act as a thought partner to a variety of stake holders • Support nodal sizing, forecasting and market share analysis for the Business Units, clearly understanding the impact of upcoming technology changes and inflections and their impact to the Business Units. • Analyze the technology and economic environment including monitoring end-user trends impacting market demand, identifying emerging new markets, and tracking worldwide customer investment plans, technology adoption and changes to the customer landscape • Track competitors' positions by customer/inflection segment and assist in sizing and prioritizing specific penetration opportunities • Assist, as needed, in constructing executive presentations for internal and external audiences Functional Knowledge • Excellent understanding of Memory technologies such as DRAM, NAND and knowledge of process integration and device physics is required. • Good understanding of advanced packaging processes and integration schemes is a strong plus. • At least 5 years of experience in semiconductor processing as a lead process integration engineer or device engineer working on leading edge technology. • Advanced degree (M.S./ Ph.D) in Materials Science/ Electrical Engineering/ Chemical Engineering/ Physics or related fields is required. • Excellent presentation skills, data analysis skills, and communication skill. • Ability to work effectively with all levels and functional areas • Knowledge of effective use of AI applications for engineering process optimization is desirable. Business Expertise • Anticipates business and regulatory issues; recommends product, process or service improvements Leadership • Leads projects with notable risk and complexity; develops the strategy for project execution Problem Solving • Solves unique and complex problems with broad impact on the business; requires conceptual and innovative thinking to develop solutions Impact • Impacts the direction and resource allocation for program, project or services; works within general functional policies and industry guidelines Interpersonal Skills • Communicates complex ideas, anticipates potential objections and persuades others, often at senior levels, to adopt a different point of view Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 20% of the Time Relocation Eligible: Yes The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable. For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.