Job Purpose The Microelectronic Design Engineering team, as part of Sanmina's Global Design Engineering Team, represents one of the key strategic growth areas. Our team provides engineering and design services in microelectronics, optical and semiconductor advanced packaging solutions supported through its in depth background in materials science, thermal/mechanical analysis, reliability engineering and advanced wafer level assembly and processing technologies.
We are seeking a Senior Design Engineer, Microelectronics and Advanced Packaging to join our team to support and lead both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases.
Nature of Duties/Responsibilities: - Technical Leadership: Act as the lead for microelectronic and advanced packaging solutions within a multidisciplinary team (RF, Optical, Reliability, and Process Engineering)
- Design and Engineering : Engineering of microelectronic packages and modules, integrating material selection, substrate layout, thermal/mechanical analysis, and DFM (Design for Manufacturing).
- Strategic Assessment: Evaluate industry trends to select microelectronic technologies and define design concepts that align with specific customer requirements and emerging market standards.
- Supplier & Lifecycle Management: Define specifications for custom outsourced components and manage the full documentation process, including BOMs, assembly drawings, and Engineering Change Orders (ECO).
- Mentorship: Provide technical oversight and guidance to junior members of the microelectronics design team.
- Communications : Interface directly with customers, management and project stakeholders on technical development updates, issues and status.
- Business Development: Support growth by interfacing with prospective customers, preparing technical proposals, and drafting quotations for novel engineering solutions.
Education and Experience: - Education: Bachelor's Degree in Mechanical Engineering, Physics, or a related technical discipline.
- Experience: Minimum of 12 years of relevant industry experience in electronic hardware design and semiconductor advanced packaging.
- Technical Expertise:
Extensive background in microelectronic and advanced packaging technologies, materials, components, manufacturing methods.
Proven track record in the technical leadership of end-to-end product development programs, from prototype to volume manufacturing. - Software Proficiency:
CAD: Expert-level skills in AutoCAD® and SolidWorks®.
Analysis: Experience with commercial FEA (Finite Element Analysis) tools.
Substrate Design: Proficiency in Cadence® Allegro® Package Designer Plus.e design software (Cadence® Allegro® Package Designer Plus). - Security Clearance: Security clearance is an asset.
Soft Skills and Attributes - Collaborative Problem Solver: Ability to navigate complex, novel issues within a fast-paced team environment.
- Communication: Exceptional verbal and written skills; ability to distill complex technical data into concise updates for stakeholders and customers.
- Agility: Comfortable managing multiple high-priority programs simultaneously.
OTHER INFORMATION - The compensation range for this position is $110,000- $160,000 annually.
- This position is for an existing vacancy.
- The hiring process for this position does not use Artificial Intelligence (AI).
