Texas Instruments

Process Development Engineer | RF Photonics

Texas Instruments • $110K — $130K *
Dallas, TX 75217In-Person
Technical Services
Less than 5 years of experience
Today
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Job Overview by Ladders

Qualifications

  • Master's/Ph.D. in Electrical Engineering, Physics, Applied Physics, or Material Science.
  • 3+ years of experience in high volume silicon photonics fab environments, specifically with non-Si high-speed modulator integration.
  • Knowledge of material physics affecting device performance for materials like Lithium Niobate and Indium Phosphide.
  • Proven history of delivering high-yield processes in heterogeneous integration for silicon photonics.
  • Expertise in statistical process control (SPC) and design of experiments (DOE).

Responsibilities

  • Lead process development and optimization for die-to-wafer bonding of non-Si chiplets.
  • Manage integration processes in cleanroom including dicing and waveguide etching.
  • Scale heterogeneous integration processes for high volume manufacturing.
  • Facilitate cross-team alignment between fab operations and R&D.
  • Collaborate with vendors to expedite process development.
  • Translate design requirements into efficient manufacturing solutions with photonic teams.
  • Establish process control and yield enhancement strategies.

Benefits

  • Collaborative work environment with cross-functional teams.
  • Opportunity to work on innovative, cutting-edge technologies.
  • Engagement with advanced process technology development.
  • Focus on high-yield and cost-effective manufacturing solutions.
  • Support in professional growth and knowledge expansion.
Full Job Description
Job Description

Senior Silicon Photonics Process Engineer - Heterogeneous Integration

Location: Dallas, TX, or Lehi, UT

Group: Kilby Labs

About the Position

Kilby Labs is seeking a highly motivated and experienced Silicon Photonics Process Engineer to lead the development and implementation of heterogeneous integration (HI) of non-Si modulator materials into high-volume silicon photonics. This role is responsible for the initial process development through volume scaling of all aspects of the HI process module including layer transfer and post transfer processing. The role requires working extensively across other internal teams including advanced process technology development, fab operations, chip design and test, and product engineering, to make innovative, high performance and cost-effective silicon photonics solutions, while also requiring a focus on high-yield, reliable, and cost-efficient manufacturing. For this role we are seeking a creative problem-solver who can develop unique, breakthrough technologies.

Responsibilities may include, but are not limited to:
  • Lead the process development, execution, and optimization of volume die-to-wafer (D2W) bonding and post-bond device processing of non-Si material chiplets, integrated in silicon photonics.
  • Owning part or all the non-Si material chiplet integration process module in the cleanroom; including the processes of dicing, grinding, die-to-wafer bonding, and waveguide etching.
  • Drive the scaling of the heterogeneous integration processes from initial R&D and prototyping phases up to high volume manufacturing.
  • Provide necessary expertise to bridge the internal fab operations, advanced process development, and Kilby R&D design teams to align HI processes with device performance requirements and fab capabilities.
  • Work with tool vendors and IP partners to reduce process development time leveraging external IP.
  • Work closely with photonic design, architecture, and packaging teams to translate design, layout, and product requirements into cost and yield optimized manufacturing solutions.
  • Establish robust process controls, root-cause failure analysis, and yield enhancement strategies to drive cost and power improvements, ensure high manufacturing yield and long-term device reliability.
  • Develop process characterization and troubleshooting procedures, including development of process monitors, test structures, critical to quality parameter specifications, metrology and inspection procedures, and correlations with device performance data.
  • Develop and maintain process reporting and documentation, including process flow descriptions, quality specifications, goal plotting, and yield reports.
  • Research and develop differentiating process techniques beyond the state of the art.


Qualifications

Minimum Requirements:
  • Master's/Ph.D. degree in Electrical Engineering, Physics, Applied Physics, or Material Science.
  • 3+ years of industry experience with one or more of the following processing steps for integration of non-Si high-speed modulator materials onto silicon photonics in a high volume silicon photonics fab environment: planarization and pre-bond surface preparation, die-to-wafer bonding, wafer-to-wafer bonding, post-bond waveguide etching and processing, and metallization.
  • Experience with material physics and process-related effects on device performance for materials such as Lithium Niobate, Lithium Tantalate, Barium Titanate, or Indium Phosphide.
  • Track record of delivering high yield process modules for high speed silicon photonics fab processes involving heterogeneous integration of non-materials in high volume manufacturing.
  • Strong expertise in statistical process control (SPC), design of experiments (DOE), and utilizing advanced material characterization techniques applied to Cpk optimization for silicon photonics with HI of non-SI materials.
  • Ability to work independently and lead cross-functional collaboration between process, fab, and design teams.


Preferred Qualifications:
  • Understanding of the mechanisms of direct bonding methods (i.e. fusion bonding) and surface chemistry of bonding
  • Hands-on cleanroom experience with dicer, grinder and bonder (die-to-wafer or wafer-to-wafer).
  • Knowledge of high-speed photonic modulator device physics, device design, and important device performance metrics
  • Understanding of characterization and testing of high-speed modulators and silicon photonic devices
  • Experience with volume manufacturing of high speed integrated photonic devices for state-of-the-art data communications products.
  • Experience using process monitor and test data analysis tools and statistical analysis tools such as JMP or statistical libraries (e.g. Matlab, Python).
  • Strong verbal and written communication skills.
  • Ideal candidates must also excel at promoting new ideas, building collaborative relationships, working across organizations.


About the Team

TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.

About Texas Instruments

National Semiconductor is a semiconductor manufacturer, specializing in analog devices and subsystems, headquartered in Santa Clara, California. The products of National Semiconductor include power management circuits, display drivers, audio and operational amplifiers, communication interface products and data conversion solutions. National's key markets include wireless handsets, displays and a variety of broad electronics markets, including medical, automotive, industrial, and test and measurement applications.

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Learn more about Texas Instruments
Size
31,000 employees
Market Cap
$148.9 billion
Industry
Manufacturing & Automotive
Net Income
$5.5 billion
Founded
1930
5 Year Trend
+6.5%
Revenue
$14.4 billion
NASDAQ
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* Ladders Estimates

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