We are seeking a Principal Early Supplier Involvement (ESI) Engineer to drive hardware co-design, manufacturability, and supply chain readiness for our next-generation Data Center AI Infrastructure platform.

In this role, you will act as the technical bridge between our System Architects, Mechanical/Thermal/Electrical Engineering teams, and strategic technology suppliers. You will engage with partners early in the concept phase (Phase 0/1) to de-risk high-density thermal architectures, complex high-speed PCBAs, and high-power delivery systems. Your goal is to ensure our AI computing systems achieve industry-leading time-to-market, uncompromised quality, and scalable cost-to-manufacture.

• Advanced Thermal & Liquid Cooling DFM: Partner with liquid cooling suppliers (CDUs, cold plates, quick disconnects/QDCs, manifolds) to review fluid dynamics, materials compatibility, leak-mitigation designs, and high-volume manufacturability.
• High-Speed PCBA & Custom Interconnects: Conduct early DFM/DFT reviews with EMS partners and substrate/PCB suppliers for complex AI accelerator boards, PCIe Gen 6/7, and optical interconnects (high layer-count PCBs, microvias, HDI).
• Power Delivery Systems: Collaborate with power supply and busbar manufacturers to optimize ultra-high-density power distribution units (PDUs), power shelves, and voltage regulator modules (VRMs) for 100kW+ rack architectures.
• Rack-Level Mechanical & Structural Integration: Work with chassis and rack-fabrication suppliers to ensure structural integrity, tolerance stack-up analysis (GD&T), and blind-mate blind-connector alignment.

• Rapid NPI Prototyping: Oversee prototype builds with primary suppliers to accelerate engineering validation test (EVT) and design validation test (DVT) cycles.
• Single/Sole-Source De-Risking: Identify single-point-of-failure components early in the CAD/schematic lifecycle and drive second-source qualifying pathways or modular redesigns.
• Should-Cost & Process Yield Modeling: Analyze early component geometry, material selection, and process flows (e.g., skived vs. stamped cold plates, high-frequency laminates) to build accurate cost models and maximize production yields.

• Education: Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or Manufacturing Engineering.
• Experience: 4–8+ years in NPI engineering, hardware design, supplier technical development, or DFM for high-density compute, networking, or data center hardware.
• Technical Expertise:
  • Hands-on experience with liquid cooling technologies (direct-to-chip, immersion, CDUs) or high-power/high-speed server architecture.
  • Advanced knowledge of GD&T, CAD software (Creo, SolidWorks, or Siemens NX), and tolerance stack-up analysis for server chasses and rack enclosures.
  • Direct experience conducting DFM reviews with Tier-1 EMS, PCB fabricators, and custom mechanical/thermal vendors.
• Soft Skills:
  • Ability to communicate effectively across cross-functional boundaries—translating high-level AI system requirements into actionable supplier specifications.
  • Strong negotiation and technical decision-making skills in high-pressure, fast-paced environments.

• Deep understanding of high-frequency materials (e.g., Megtron 6/7/8) and high-density interconnect (HDI) manufacturing.
• Familiarity with Telcordia, OCP (Open Compute Project) standards, and NEBS compliance.
• Experience with automated should-cost tools (e.g., aPriori) and PLM systems (Agile, Windchill).

 ZT Systems, a Sanmina Company,  assesses market data to ensure a competitive compensation package is created for all our employees. The typical base salary for this position is expected to be between $116,250 and $193,750 annually. If hired, the final base salary will be determined on an individual basis taking into consideration experience, skills, knowledge, education and/or certifications.

Base salary is just one component of ZT Systems total rewards philosophy. We take pride in offering a wide range of benefits and perks that appeal to the variety of needs across our diverse employee base. Other rewards may include bonus, paid time off, 401(k) retirement savings plan, tuition reimbursement, wellbeing resources, and more.

We are dedicated to building a diverse, inclusive, and authentic workplace, so if you’re excited about this opportunity but your experience doesn’t align perfectly with every qualification in the job description, we encourage you to apply anyway. You may be just the right candidate for this or other roles.

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