Advanced Micro Devices, Inc

Packaging Design Engineer

Advanced Micro Devices, Inc • $110K — $130K *
San Jose, CA 95123In-Person
Manufacturing & Automotive
Less than 5 years of experience
Today
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Job Overview by Ladders

Qualifications

  • Bachelor's or Master's degree in Engineering
  • 5+ years of experience in package design engineering
  • Strong communication skills for cross-team collaboration
  • Ability to understand electrical requirements for packaging
  • Familiarity with Cadence and simulation tools
  • Experience with PCB technologies and layout guidelines
  • Knowledge of high-speed design principles, including SerDes constraints.

Responsibilities

  • Utilize Cadence tools for design, modeling, and simulation.
  • Define package/module design requirements through analytical and simulation tools.
  • Conduct routing, stack-up, and component placement studies for various device packages.
  • Collaborate with PCB Layout Engineers to enhance package ballmap and die size optimization.
  • Develop high-performance multi-signal package/models suitable for over 50 GHz bandwidth.
  • Establish performance metrics for organic package technologies aimed at high-speed systems.
  • Perform Power Integrity analysis to generate power delivery network requirements.

Benefits

  • Comprehensive AMD benefits package.
  • Opportunities for career development and advancement.
  • Flexible working arrangements with a hybrid model.
  • Access to cutting-edge technology and resources.
  • Collaborative and innovative team environment.
Full Job Description
THE TEAM:

The AECG - Embedded Team builds and optimizes platforms for embedded and commercial applications, working across silicon, firmware, and software to deliver reliable, high-performance solutions at scale.

THE ROLE:

The AMD Adaptive and Embedded Computing Group is seeking an experienced and self-motivated package design engineer. As a key member of the Package group, you will work across chip, technology and systems teams to define cost effective and high performance solutions.

THE PERSON:

This is a high visibility position working on multiple package families for the FPGA devices. The ideal candidate should have the ability to understand electrical requirements and translate to the proper package technology requirements that is cost effective and manufacturable. This role requires good communication skills to work with other teams and engineers at the various design centers to carry the projects from design start to signoff stages.

KEY RESPONSIBILITIES:
  • Use Cadence tools for design, modeling and simulations. Enable timely closure of designs by getting involved with pre-design negotiations with chip/system teams and take it to design sign off.
  • Use analytical and simulation tools to define package/module design requirements (technology, stack-up, etc.) in the project conception stages and negotiate with chip/system teams on product specification.
  • Conduct routing, stack-up & component placement studies in addition to completing the package design activities. Translate requirements (Design guidelines, technology, stack-up, manufacturing time etc) for various device packaging.
  • Collaborate with PCB Layout Engineers to optimize the package ballmap and chip team to optimize the die size.
  • Develop multi-signal package/module models over 50 GHz bandwidth and suitable test structures for model to measurement correlation.
  • Come up with performance metrics for organic package technologies in order to design high speed chips and systems.
  • Performing Power Integrity analysis for core as well as IO and generate power delivery network requirements with emphasis on model to measurement correlation.
  • Develop scripts for checking package parameters across device families, maintain a database of electrical design guidelines and rules for IO and PDN package layout implementations.

PREFERRED EXPERIENCE:
  • Have a good understanding of various Organic/PCB technologies in order to interpret/negotiate layout guidelines.
  • Package/PCB layout experience. Experience in high power, Gbs IO products is a plus.
  • Current working Knowledge of Cadence package design tool is a must. knowledge of SKILL is a plus.
  • Working knowledge of 2D/3D package design and modeling tools, such as Cadence, Ansys, AutoCAD etc.
  • Knowledge on DoE, DFM/DFR is a plus.
  • Good knowledge of SerDes design and package/PCB layout constraints.
  • Mentor junior package designers in the group.

ACADEMIC CREDENTIALS:
  • Bachelor's or Master's degree in Engineering

LOCATION: San Jose, CA ; San Diego, CA

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Benefits offered are described: AMD benefits at a glance.

About Advanced Micro Devices, Inc

Advanced Micro Devices, Inc. Careers

Join the innovative forefront of technology with a career at Advanced Micro Devices, Inc. (AMD), a leader in semiconductor development. As part of our global team, you will contribute to an organization renowned for its dedication to innovation, leadership, and diversity in the tech industry.

Work You’ll Do

At AMD, we offer job opportunities that push the boundaries of what is possible. Our team is composed of professionals who lead the way in microprocessor and graphics technology, driving industry standards and innovation. With AMD, you will be part of a culture that values growth and professional development, ensuring that every team member has the opportunity to excel.

Transform Your Career

AMD is not just about advancing technology, but also about advancing careers. Whether you are looking for an internship, a full-time position, or leadership roles, AMD provides the platform to propel your career to new heights. Our commitment to professional growth is matched by our dedication to diversity and inclusion, making AMD a place where everyone can thrive.

Innovative Work Environment

Join a team of over 12,000 dedicated professionals at the intersection of technology, industry expertise, and digital innovation. At AMD, you will work on groundbreaking projects that shape the future of computing and graphics. Our collaborative environment encourages networking and the sharing of ideas across teams and disciplines.

Career Development and Benefits

AMD is committed to the development of its employees. We offer robust training programs, including leadership development and diversity training, to ensure our team is equipped for both current challenges and future opportunities. Our benefits package is designed to support the well-being and financial security of our employees and their families.

Explore Job Opportunities

From engineering to marketing, AMD offers a range of career paths that cater to diverse skills and interests. Our hiring process is designed to be transparent and engaging, helping you to understand where you fit within our team and how you can contribute to our collective goals.

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Prepare for your future with AMD by accessing resources that help you craft your resume and excel in interviews. Our goal is to help you showcase your best professional self and align your skills with the needs of our dynamic team. At Advanced Micro Devices, Inc., we empower our employees to innovate, lead, and grow. Join us in driving the future of technology while building a rewarding and sustainable career.
Learn more about Advanced Micro Devices, Inc
Size
15,500 employees
Market Cap
$100.9 billion
Industry
Manufacturing & Automotive
Net Income
$2.4 billion
Founded
1969
5 Year Trend
+30.9%
Revenue
$9.7 billion
NASDAQ
AMD
* Ladders Estimates

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