General InformationReq # WD00108617
Career area: Hardware Engineering
Country/Region: United States of America
State: North Carolina
City: Morrisville
Date: Wednesday, November 11, 2026
Working time: Full-time
Additional Locations:
* United States of America - North Carolina - Morrisville
Description and RequirementsPosition OverviewLenovo Infrastructure Solutions Group (ISG) is seeking an experienced
Thermal Engineer to lead the development and qualification of advanced thermal solutions for next-generation server and rack infrastructure deployed in cloud and AI-driven data centers. This role will be responsible for thermal architecture, CFD modeling, cooling solution development, and system-level thermal validation across compute, storage, and GPU platforms.
The ideal candidate will bring a strong background in server thermal engineering, airflow optimization, liquid and air-cooling technologies, and data-driven problem solving. This individual will work closely with cross-functional engineering teams and customers to ensure products meet thermal, performance, reliability, and production readiness requirements.
Key Responsibilities - Develop, design, and qualify thermal solutions for rack and server infrastructure supporting cloud data centers, including compute, storage, and GPU platforms.
- Own server- and rack-level thermal architecture from concept through design validation, qualification, and production readiness.
- Design and optimize thermal management solutions utilizing both air-cooling and liquid-cooling technologies.
- Perform Computational Fluid Dynamics (CFD) simulations using ANSYS Icepak, FloTHERM, or equivalent tools to evaluate airflow, pressure, heat distribution, component temperatures, and overall system performance.
- Optimize airflow, fan performance, acoustics, thermal margins, and energy efficiency at system and rack levels.
- Define thermal validation strategies, test plans, methodologies, qualification requirements, and acceptance criteria based on product and customer requirements.
- Execute thermal, airflow, power, performance, and system-level validation testing across varying workloads and environmental conditions.
- Correlate simulation models with physical test results and continuously improve thermal model accuracy and design effectiveness.
- Analyze thermal, airflow, power, telemetry, and performance data to identify trends, design limitations, and opportunities for optimization.
- Lead root-cause analysis and resolution of complex thermal and system-level issues.
- Partner with mechanical, electrical, firmware, system, validation, manufacturing, and supplier engineering teams to drive issue resolution and product readiness.
- Support customer engagements and technical reviews by presenting thermal design recommendations, risk assessments, and qualification results.
- Create and maintain engineering specifications, simulation reports, test plans, validation reports, technical presentations, and related engineering documentation.
Basic Qualifications - Bachelor's degree in Mechanical Engineering, Thermal Engineering, or a related engineering discipline.
- 8+ years of experience in thermal engineering, preferably supporting server platforms, data center infrastructure, high-performance computing (HPC), AI systems, or electronics cooling applications.
- Strong understanding of server architecture and major hardware components, including CPUs, GPUs, DIMMs, NVMe storage, NICs, power supplies, and cooling subsystems.
- Deep knowledge of heat transfer, thermodynamics, fluid mechanics, airflow management, thermal margins, and cooling solution development.
- Hands-on experience performing server thermal, power, airflow, and performance validation testing.
- Experience using CFD and thermal simulation tools such as ANSYS Icepak, FloTHERM, or similar industry-standard platforms.
- Demonstrated ability to analyze thermal sensor data, power measurements, system telemetry, performance metrics, and test logs to drive engineering decisions.
- Proven experience troubleshooting complex thermal and system-level issues and leading root-cause investigations.
- Strong technical documentation skills, including development of engineering specifications, simulation models, validation plans, and qualification reports.
- Excellent communication and collaboration skills with the ability to work effectively across multidisciplinary engineering organizations.
Preferred Qualifications - Master's degree in Mechanical Engineering, Thermal Engineering, or a related technical field.
- Experience designing and qualifying liquid cooling solutions for high-density server, AI, or HPC deployments.
- Experience supporting rack-level thermal solutions for cloud, hyperscale, or enterprise data center environments.
- Familiarity with GPU-intensive platforms and thermal considerations for AI and accelerated computing workloads.
- Experience optimizing server acoustics, fan control strategies, airflow efficiency, and power utilization.
- Knowledge of firmware interactions related to thermal management and system cooling controls.
- Experience working directly with suppliers, ODMs, manufacturing partners, and customers on thermal design and qualification activities.
- Exposure to embedded systems, power electronics, PCB design, hardware validation, electromagnetic compatibility (EMC), and advanced thermal management technologies.
- Proven ability to communicate technical concepts and design recommendations to both engineering and customer stakeholders.
Additional Locations:
* United States of America - North Carolina - Morrisville
