Strong understanding of semiconductor packaging constraints and manufacturability.
Responsibilities
Lead thermal design and development of advanced semiconductor power solutions.
Architect thermal management solutions for high power-density products.
Perform detailed thermal simulations using ANSYS Icepak, FloTHERM, and CFD methodologies.
Develop and optimize mechanical designs using SolidWorks for thermal assemblies.
Conduct steady-state and transient thermal analysis to enhance performance and reliability.
Evaluate and select thermal interface materials and cooling technologies.
Drive prototype builds and thermal validation, correlating simulation with lab data.
Benefits
Participation in an incentive plan for all employees.
Full Job Description
Your role
Key responsibilities in your new role
Lead thermal design and development of advanced semiconductor power solutions, including IVR, VRM, and power module platforms
Architect thermal management solutions for high power-density products utilizing liquid cooling, cold plates, manifolds, heat sinks, and TIM materials
Perform detailed thermal simulations using ANSYS Icepak, FloTHERM, FEAtools, and CFD methodologies
Develop and optimize mechanical designs using SolidWorks for thermal assemblies and packaging solutions.
Conduct steady-state and transient thermal analysis to improve performance, reliability, and manufacturability.
Evaluate and select thermal interface materials (TIMs), cooling technologies, and advanced materials for semiconductor applications.
Partner cross-functionally with electrical, package, reliability, manufacturing, and systems engineering teams.
Drive prototype builds, thermal validation, and correlation between simulation and lab data.
Mentor junior engineers and provide technical leadership across thermal engineering initiatives.
Influence product roadmap decisions related to thermal performance, packaging, and system integration.
Your profile
Qualifications and skills to help you succeed
Bachelor's or Master's degree in Mechanical Engineering or relateddiscipline. PhD is a plus.
8-10+ years of thermal/mechanical design experience within the semiconductor, power electronics, or advanced electronics cooling industry.
Expert proficiency in SolidWorks for 3D mechanical design.
Strong hands-on experience with FloTHERM, ANSYS Icepak, and FiniteElement Analysis (FEA) tools.
Deep knowledge of liquid cooling systems, including cold plates,manifolds, pumps, and coolant flow optimization.
Experience designing heat sinks, vapor chambers, TIM interfaces, and package level thermal solutions.
Strong understanding of semiconductor packaging constraints,reliability, and manufacturability.
Ability to lead programs independently and communicate effectively with executive and technical teams.
Salary pay information:
LocationIndicative salary rangeSan Jose, United StatesWage range that the company expects to pay for a qualified candidate:
US$ 223,440 - US$ 307,230
In addition, all employees will be eligible to participate in an incentive plan.
About Infineon Technologies
Infineon Technologies AG is a German semiconductor manufacturer that produces a wide range of products including microcontrollers, power semiconductors, and sensors. The company was founded in 1999 and is headquartered in Neubiberg, Germany. Infineon Technologies has a global presence with operations in Europe, Asia, and the Americas. The company's mission is to make life easier, safer, and greener with technology.
