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Job Description:Broadcom is seeking an experienced SI/PI Technical Project Manager to lead a team of engineers designing complex flip-chip-BGA packages, PCBs, system channel links for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.These designs include SerDes at 448G and higher, Optics, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. In this role, you will support and develop the engineering team, as well as contribute to technical methodologies and technical project management.
RESPONSIBILITIES:
Technical Project Management : Navigate and track project plans for 20+ concurrent pkg/PCB designs (scope, schedules, resources) from a technical execution standpoint
Understand the skill sets and traits of each team member, in order to maximize productivity and retention
Organize team & customer activities to keep projects on track
Clearly and concisely communicate plans, status, next steps and risks on a regular basis
Create technical methodologies for signal and power integrity solutions
Understanding and supporting package and PCB technologies with input from team members
Customer, vendor, & cross-functional collaboration
EDUCATION/EXPERIENCE & REQUIREMENTS:
Preferred candidates have previous experience managing people and projects
BSEE and 12+ years of experience in ASIC and system signal and power integrity for high-speed SerDes AND a minimum of 3 years in leadership/management.
Knowledge of package-level, PCB-level, and/or system level signal integrity and power integrity, to apply to package and PCB designs.
Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
Self-management, organization, and clear communication skills
Technical understanding related to System Signal and Power Integrity development and support :
SI/PI EDA extractions and simulations
System level SerDes channel results
Lab measurements - passive and active
Lab and measurement correlation efforts
Lab equipment needs and management
Package and PCB lifecycle and design flows
How the substrate and package fit into the overall system implementation and trade-offs therein to support customers effectively
Design Data, including how it is created and utilized (e.g. package:: .mcm, package spreadsheet, drawings (POD, Lid, Substrate))
Automation code development
Project Management
OTHER REQUIREMENTS:
This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position. This role is deeply collaborative and requires direct, real-time engagement with lab equipment and face-to-face team co-design.
Compensation and Benefits
The annual base salary range for this position is To
As a valued member of our team, youll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the companys growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
