At least 5 years of experience in R&D or Product Engineering, preferably in semiconductor equipment.
Proficient in mechanical and mathematical modeling tools such as Visual Basic, MS Excel, MATLAB, Python, and Mathcad.
Hands-on experience with test set-up, troubleshooting, and lab equipment including laser displacement and optical microscopes.
Experience collaborating with vendors and subcontractors.
Master's or Bachelor's degree in Mechanical Engineering, Mechatronics Engineering, or equivalent; PhD candidates are encouraged to apply.
Responsibilities
Design and develop electro-mechanical and software systems, integrating specialized subsystems into products.
Analyze and test Ultrasonic Transducers and Sensors using various modeling and simulation techniques.
Solve complex engineering problems using experimental methods like design of experiments (DOE) and statistical analysis.
Evaluate data and situations to select appropriate methods and techniques for analysis.
Prepare engineering plans and programs as needed.
Operate wire bonders and other test equipment independently, providing guidance to team members.
Conduct tests on bench setups or wire bonders, utilizing instruments like oscilloscopes.
Benefits
Opportunity to work in a highly skilled and motivated engineering team.
Encouragement to take on a broad range of responsibilities.
Exposure to cutting-edge semiconductor packaging and assembly technologies.
Potential for professional growth and development within the organization.
Full Job Description
Job Description
We are seeking an engineer who with their related experience will provide solutions support of the development of Semiconductor Packaging and Assembly equipment. The candidate will be a member of a highly skilled and motivated engineering team and will be encouraged to take on the responsibility of a broad range of tasks. You will be responsible for transforming concepts into actual parts of the system, and testing the developed module, the system integration and verifying if requirements are met.
Responsibilities
Specific duties will include:
Detailed design, analysis, development and organization of electro-mechanical and / or software systems, consisting of specialized sub-systems and their integration into products and applications.
Design, analyze and testing of Ultrasonic Transducers and Sensors, including Bode, Vibrometer, FE modeling and simulations
Problem solve on a wide range of difficult problems within an engineering discipline in imaginative and practical ways, utilizes experimental methods such as design of experiments (DOE), analysis of variants, linear regression analysis, statistical process and control.
Analysis of situation or data requiring detailed evaluation of identifiable factors, exercises judgment within broadly defined practices and policies in selecting methods, techniques and evaluation criteria for obtaining results.
Assist in preparation of engineering plans and programs.
Independent operating of wire bonders and other test and measurement equipment. Receive minimal instruction on new assignments and provide technical guidance and leads or coordinates the activities of other engineers, designers and technicians.
Running tests on bench or on the wire bonder.
Collect and analyze data and write engineering report and presentations.
Tests could involve using oscilloscope and other instruments as needed.
Qualifications
Knowledge & Experience requirements
At least 5 years of experience in R&D or Product Engineering, Semiconductor equipment experience is preferred.
Experience with mechanical and mathematical modeling tools (Visual Basic, MS Excel, MATLAB, Python, Mathcad)
Hands-on experience - test set-up, troubleshooting, design of experiments, lab equipment, etc. (for example using test equipment such as laser displacement, optical microscopes, shear and pull tester, SEM, ion mill, chemical etching)
Experience working with vendors and sub-contractors
Education Requirements
Masters or Bachelor's degree with at least 5 years of experience in Mechanical engineering, Mechatronics Engineering or equivalent. PhD in relevant areas are highly encouraged to apply.
Other requirements
Good written and verbal communication, interpretation and interpersonal skills
Flexible to changes in tasks and work environment
Must be organized, systematic, punctual, and goal-oriented
Strong leadership skill with ability to work with cross functional teams
Willing to travel on a need basis
About Kulicke & Soffa
Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (ICs), high and low powered discrete devices, light-emitting diodes (LEDs), and power modules. The Company also services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company operates through two segments: Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and electronic assembly solutions. The Expendable Tools segment manufactures and sells expendable tools and materials used in the semiconductor packaging process, such as soldering tools, bonding wires, advanced packaging materials, hybrid materials and shims. The Company's customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers.
