Full Job Description
Summary of Role:
The Optical Proximity Correction (OPC) Engineer develops computational lithography solutions that enable robust patterning and manufacturability of advanced semiconductor technologies. This role develops and maintains OPC technology files and works across lithography, design rules, etch, modeling, and infrastructure teams to improve pattern fidelity, process margin, and yield.
Essential Responsibilities:
• Develop, qualify, maintain, and optimize OPC technology files, recipes, and computational lithography solutions for advanced-generation semiconductor lithography processes.
• Develop and evaluate OPC strategies, model-based corrections, and patterning solutions to improve wafer pattern fidelity, process-window performance, manufacturability, and yield.
• Collaborate with design rule, lithography, etch, metrology, modeling, mask, and computational infrastructure engineers to define and implement optimal computational patterning solutions.
• Perform root-cause analysis of printing, patterning, and yield-limiting hotspots using simulation, wafer data, design data, and established computational lithography analysis tools.
• Validate and release OPC solutions through simulation-to-wafer correlation, process-window assessment, hotspot verification, and appropriate quality and change-control methodologies.
• Develop automated analysis, verification, and data-processing workflows that improve OPC development efficiency, coverage, reproducibility, and cycle time.
• Research, apply, and continuously improve industry and company best practices in OPC, computational lithography, patterning optimization, and design-to-manufacturing interaction.
• Participate in cross-functional semiconductor technology development projects and communicate technical results, risks, recommendations, and solution readiness to key stakeholders.
Other Responsibilities:
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
• Work and collaborate on other projects and/or assignments as needed.
Required Qualifications:
• Education - Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, Applied Physics, Materials Science, Chemical Engineering, or a related technical field.
• Experience - Minimum years of relevant experience in optical proximity correction, computational lithography, semiconductor lithography, patterning, or a related field to be aligned with the applicable GF career level and scoping guidelines.
• Skills - Working knowledge of semiconductor lithography, optical proximity effects, OPC concepts, process-window behavior, pattern fidelity, and semiconductor manufacturing fundamentals.
• Skills - Experience with computational lithography, OPC development, lithography simulation, hotspot analysis, or related semiconductor patterning tools and methodologies.
• Skills - Ability to analyze complex simulation and wafer data, perform structured root-cause analysis, and translate findings into computational or process improvements.
• Skills - Experience with scripting or programming for engineering automation and data analysis, such as Python, Perl, Tcl, shell scripting, or equivalent.
• Travel - Up to 10%.
• Fluency in English Language - written & verbal.
Preferred Qualifications:
• Education - Master's degree or PhD in Electrical Engineering, Physics, Applied Physics, Materials Science, Chemical Engineering, or a related technical field.
• Experience - Experience developing, qualifying, and maintaining production OPC technology files for advanced semiconductor process technologies.
• Skills - Experience with model-based OPC, lithography modeling, computational patterning, process-window optimization, mask data preparation, or design-technology co-optimization.
• Skills - Familiarity with leading computational lithography and OPC platforms and large-scale compute environments used for semiconductor mask synthesis and verification.
• Skills - Experience correlating computational lithography simulations with wafer metrology and using silicon results to improve OPC models, recipes, or process assumptions.
• Skills - Understanding of interactions among lithography, etch, design rules, mask manufacturing, metrology, and yield.
• Project management skills - i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning & organizational skills.
Expected Salary Range
$85,000.00 - $146,000.00
The exact Salary will be determined based on qualifications, experience and location.
