Job Details:Job Description:The Role and Impact
As a Process Integration and Yield Engineer, you will play a pivotal role in driving technology improvement and manufacturing excellence. You will define process integration roadmaps, analyze large volumes of structured and unstructured data, and implement solutions that enhance quality, yield, and defect reduction. Working across internal and external teams, your contributions will directly support ramping advanced packaging solutions and sustaining high-volume manufacturing processes.
Key Responsibilities
- Define and establish process flows, procedures, and equipment configurations for manufacturing modules.
- Extract insights from data using statistical analysis, coding, and machine learning techniques.
- Drive yield analysis and defect reduction initiatives to support process improvement.
- Conduct quality and reliability risk assessments for manufacturing materials and process changes.
- Collaborate with cross-functional teams to ensure successful technology transfer and ramp-up activities.
- Develop monitoring systems, dashboards, and methodologies to sustain and enhance manufacturing performance.
- Lead low yield analysis and yield improvement activities in both startup and high-volume manufacturing environments.
The ideal candidate should exhibit the following behavioral traits:
- Strong troubleshooting skills and innovative problem-solving approaches.
- Excellent verbal and written communication skills.
Qualifications:Minimum Qualifications
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Microelectronics Engineering, Chemistry, Physics, or related field and 4+ year of experience.
OR
Master's degree in the fields above with 3+ years of experience.
OR
PhD degree in the fields above with 1+ years of experience.
Experience listed above should be a combination of the following:
- Experience in semiconductor manufacturing or advanced packaging.
- Expertise in process integration, defect reduction, and backend interconnect or advanced packaging processes.
- Experience in statistical analysis tools such as JMP, SQL, and statistical process control (SPC).
- Experience with Design of Experiments (DOE) principles and Failure Mode Effects Analysis (FMEA)
Preferred Qualifications
- Experience presenting yield summaries and engaging with external foundry customers.
- Demonstrated ability to analyze defects and parametric data to drive yield improvements
- Proven track record in new semiconductor technology development and transfer.
Job Type:Experienced Hire
Shift:Shift 1 (United States of America)
Primary Location:US, New Mexico, Albuquerque
Additional Locations:US, Oregon, Hillsboro
BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $120,860.00-231,670.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
