Job DescriptionAs a Process Development Engineer at Solidigm you will be responsible for delivering module capability for the next node on the 3D NAND technology roadmap, partnering with the module process development team at the factory, as well as engaging with equipment vendors to deliver cost-effective and manufacturable process technology.
Key Responsibilities- Lead the development and optimization of processes for 3D NAND semiconductor manufacturing
- Collaborate with cross-functional teams to identify and solve process issues and drive yield improvement
- Utilize your strong understanding of process principles, equipment, and materials to design and implement innovative solutions as well as driving cost reduction
- Conduct experiments and analyze data to make data-driven decisions for process improvements
- Monitor and track process performance, identify areas for improvement, and implement corrective actions
- Stay updated on industry trends and advancements in 3D-NAND technology and integrate them
- Train and mentor junior engineers on processes and techniques
- Collaborate with equipment suppliers to ensure the smooth integration of new equipment and processes
- Contribute to the development of new process technologies to maintain competitive edge in the industry
QualificationsRequired Qualifications:- A Master's degree in Electrical Engineering, Material Science Engineering, Physics, or similar technical degree.
- 12+ years' experience semi-conductor industry experience
- 7+ years direct process development experience
- Established track record of innovation and results
Preferred Qualification- The ideal candidate will have direct experience in 3D NAND process development.
- Willing to travel and work 25% of time in manufacturing fab outside US.
Additional InformationThe compensation range for this role is $139,520- $223,300. Actual compensation is influenced by a variety of factors including but not limited to skills, experience, qualifications, and geographic location.
