Cadence Design Systems

Principal Product Engineer

Cadence Design Systems • $140K — $260K *
Consumer Technology
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • BS in Electrical Engineering or related field.
  • Strong experience in semiconductor design and physical implementation.
  • Hands-on knowledge of Cadence Virtuoso platform and custom IC design flows.
  • 10+ years of relevant experience or equivalent expertise.
  • Proven ability to work independently and prioritize tasks.
  • Strong verbal and written communication skills for collaboration across diverse teams.
  • Motivated by advancements in 3D IC and heterogeneous integration technologies.

Responsibilities

  • Drive and validate end-to-end solutions for 3D IC and advanced packaging.
  • Understand customer challenges and translate them into product specifications.
  • Produce high-quality Product Requirement Specifications and use cases.
  • Collaborate with R&D, Product Management, and Field teams to deliver customer-ready capabilities.
  • Create and deliver application workflows and enablement materials.
  • Troubleshoot design-flow issues and provide technical guidance.
  • Support product launches and industry events, ensuring accountability for deliverables.

Benefits

  • Paid vacation and paid holidays.
  • 401(k) plan with employer match.
  • Employee stock purchase plan.
  • Variety of medical, dental, and vision plan options.
Full Job Description
Job Title: Principal Product Engineer

Location: San Jose, California, United States

Reports to: Product Engineering Director

Job Overview:

As Product Engineer, you are responsible for driving the definition, early deployment, and broader adoption of the Cadence Virtuoso Heterogeneous Integration technologies. You work with strategic customers, Product Management, R&D, Product Validation, and Application Engineering teams to define requirements, validate solutions, and accelerate customer success in physical implementation flows for 3D IC, heterogeneous integration, and advanced packaging.

Job Responsibilities:

  • Drive, validate, and promote an end-to-end solution for system design implementation flows spanning 3D IC, heterogeneous integration and advanced packaging.
  • Partner with leading semiconductor customers to understand complex system co-design challenges and translate them into clear product specifications.
  • Produce high-quality Product Requirement Specifications (PRS), technical use cases, and support R&D throughout product development.
  • Collaborate cross-functionally with R&D, Product Management, Field teams, Technical Publications and Product Validation to deliver robust, customer-ready capabilities.
  • Create and deliver demonstration collateral, application workflows, and enablement materials to accelerate customer and field adoption.
  • Troubleshoot design-flow issues, provide technical guidance and workarounds, and drive bug/enhancement prioritization.
  • Support product launches, customer engagements, and industry events.
  • Own deliverables from definition through customer deployment with a strong focus on execution and accountability.


Job Qualifications:

  • BS in Electrical Engineering, Electronics, or a related technical field.
  • Strong experience in semiconductor design, physical implementation, advanced packaging, or EDA product engineering.
  • Strong hands-on knowledge of the Cadence Virtuoso platform and associated custom IC design flows.
  • 10+ years of relevant experience, or equivalent demonstrated expertise.
  • Proven ability to work independently, prioritize effectively, and take responsibility for technical deliverables.
  • Strong verbal and written communication skills, with the ability to collaborate effectively across global and multicultural teams, and across functions.
  • Highly motivated by the rapidly evolving landscape of 3DIC, heterogeneous integration, and advanced packaging technologies, with a passion for driving innovation in next-generation semiconductor solutions.


Additional Skills/Preferences:
  • Experience with software product definition, validation, or technical marketing activities.
  • Experience with co-design flows around 3D IC, heterogeneous integration, silicon-package-board integration.
  • Knowledge of Cadence Allegro Package Designer Plus (APD+) and package implementation methodologies.
  • Knowledge of Cadence Virtuoso SKILL language or any other interpreted language.


Additional Information:

The annual salary range for California is $140,000 to $260,000. You may also be eligible to receive incentive compensation: bonus, equity, and benefits. Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure. Please note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location. Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.

About Cadence Design Systems

Cadence Design Systems, Inc. is an American multinational electronic design automation software and engineering services company, founded in 1988 by the merger of SDA Systems and ECAD, Inc. The company produces software, hardware and silicon structures for designing integrated circuits, systems on chips (SoCs) and printed circuit boards.
Learn more about Cadence Design Systems
Size
9,300 employees
Market Cap
$43.9 billion
Industry
Net Income
$590.6 million
Founded
2018
5 Year Trend
+10.5%
Revenue
$2.6 billion
NASDAQ

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