General InformationReq # WD00108780
Career area: Hardware Engineering
Country/Region: United States of America
State: North Carolina
City: Morrisville
Date: Wednesday, November 11, 2026
Working time: Full-time
Additional Locations:
* United States of America
Description and RequirementsAbout Our TeamWe are hiring a senior Data Center Switch system architect to work in Lenovo's Cloud Service Provider Group (CSP). This role will define next-generation switch and rack-scale hardware architectures for hyperscale, cloud and AI data centers-from switch system platforms and rack-level interconnect-and will ensure those platforms meet the bandwidth, power, thermal, reliability and cost targets of large-scale AI fabrics.
What You'll Do- Lead next-generation data center switch and rack-scale system hardware architecture from concept through product delivery.
- Define switch platform architectures for:
- Data center leaf/spine and top-of-rack switches
- AI scale-up switch systems and rack-level interconnect systems
- High-density liquid-cooled rack-scale integrated systems
- Assess the hardware evolution of data center switches, AI server and rack systems; develop 2-3 year technology roadmaps through technology and competitive analysis, identify and select the key next-generation technologies, and establish the justification for new programs.
- Decompose system-level requirements into mechanical, thermal, power, interconnect and manufacturability subsystems; develop system block diagrams, topology and architecture specifications and drive solutions to closure.
- Define high-speed interconnect architecture including switch chip selection, high-speed PCB channels, connectors, copper cables and optics, in close cooperation with SI/PI teams.
- Define power architecture for switch systems, covering PSU and power shelf selection, 48V/12V distribution, hot-swap and protection, efficiency and thermal coupling at rack level.
- Define mechanical and thermal architecture for switch and rack-scale systems, covering air and liquid cooling, serviceability and rack integration, and own the rack-scale platform from design through mass production.
- Conduct architecture trade-off studies across bandwidth, radix, latency, power, thermal, density, reliability, serviceability, manufacturability, cost and time-to-market.
- Drive high-availability and RAS architecture, including redundancy, hot swap, fault isolation, recovery, telemetry and serviceability.
- Align with network architecture and teams to ensure fabric requirements such as lossless Ethernet/RoCE and InfiniBand are reflected in switch hardware design, and work with SI/PI, power, thermal, mechanical, firmware/network OS, validation and software teams to optimize the complete system design.
Basic Qualifications:- Bachelor's degree in Electrical Engineering, Electronic Engineering, Telecommunication Engineering, Microelectronics, Computer Engineering, Computer Science or related field.
- 10+ years of datacom hardware system development experience, with a proven record of leading router, switch or server system programs.
- Deep expertise in at least one of mechanical structure, thermal or power, with solid working knowledge of the other two, plus demonstrable cases of leading cross-discipline design and manufacturing issue resolution.
- Strong understanding of switch system architecture, including switch ASIC and SerDes, high-speed PCB and interconnect, optics and copper cabling, power and thermal design, plus strong system-level trade-off capability.
- Working knowledge of Ethernet switching, TCP/IP and network virtualization sufficient to translate fabric requirements into switch hardware requirements, with familiarity of InfiniBand/RoCE loss less network requirements.
Preferred Qualifications:- Master's degree in Electrical, Computer or Telecommunication Engineering or related field.
- AI data center experience in rack-level scale-up interconnect, high-density liquid-cooled rack systems, or large-scale AI cluster network deployment with InfiniBand/RoCE fabrics, including design and mass production.
- Experience defining a product from 0 to 1, with knowledge of switch silicon and ASIC roadmaps, 800G/1.6T optics, copper cables and connector technologies, and OCP/Open Rack/rack-scale infrastructure standards.
- Strong architecture leadership, communication and executive presentation skills.
Additional Locations:
* United States of America
PAY TRANSPARENCYThe anticipated annual compensation range for this position is
184,800-283,360 USD. Final compensation will be based on relevant experience, skills, and business considerations. Individuals may also be considered for bonuses and/or commissions. Lenovo's various benefits can be found at www.lenovobenefits.com
In compliance with Colorado's Equal Pay for Equal Work Act (EPEWA), the expected application deadline for this position is 12-07-2026. This requirement applies to both internal and external candidates.
