Engineering Manager, MicrofabricationThe OpportunityEnaChip is looking for an Engineering Manager to lead our microfabrication R&D team. This is primarily a people and project management role: organizing a small, talented team that is optimizing our fabrication process while also producing customer parts in small quantities. It's an opportunity to help push the boundaries of what's possible in high-frequency power magnetics, working at the leading edge of a platform that's bringing magnetics directly into the semiconductor stack. You'll join a young, growing team, with an opportunity to own a key leadership role as the company scales. This position will work onsite in Philadelphia five days per week.
Key ResponsibilitiesTeam leadership
- Lead the microfabrication team (clean room processing and electroplating) with ownership of day-to-day execution, reporting to the COO
- Set clear weekly priorities and deadlines with each engineer and keep the team on track to meet them
- Run a brief daily stand-up and a weekly planning review, and flag risks to the COO early so problems can be solved together
- Foster a culture of reliability and professionalism: consistent lab hours, a well-kept shared space, and good lab etiquette
- Serve as the on-site partner to a remote COO, providing clear, organized written updates on progress and needs
- Balance process optimization work with the production of customer parts in small quantities, keeping both on schedule
Process infrastructure (first-year focus)
- Build out the fabrication documentation system: standard operating procedures (SOPs) and process travelers, and run sheets
- Develop standard analysis and reporting templates so characterization results are captured consistently and easy to compare across runs
- Establish a simple document control practice (naming, versioning, storage, review) and coach the team on using it
- Translate device design requirements into a weekly fabrication schedule for development lots, process optimization runs, and customer builds
- Identify process and scheduling bottlenecks and propose practical improvements to cycle time and yield
- Drive process improvement and materials selection, working with vendors to source the right materials, chemistries, and consumables for the process
Hands-on technical support
- Learn EnaChip's microfabrication and electroplating processes through structured training, with the goal of running tools and steps independently
- Provide hands-on support in processing or plating when the team needs extra capacity or coverage
Qualifications- Bachelor's or Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, or a related field
- 1 to 5 years of experience managing an engineering or technical team
- Industry experience or knowledge of semiconductor wafer level packaging (i.e. MEMS, photolithography, electroplating, WLCSP redistribution layers, or similar)
- Excellent written and verbal communicator who keeps stakeholders informed without being asked
- Strong collaborator who builds trust with a small team and holds people accountable with respect
- Highly organized, with a track record of creating structure (schedules, documentation, process) where little existed
- Comfortable learning new hands-on processes and stepping into the lab when needed
Nice to Have- Direct experience with semiconductor microfabrication, clean room operations, or electroplating
- Experience building SOPs, process travelers, or document control systems
- Experience in a startup or early-stage hardware environment
- Experience managing small-volume production alongside R&D
Compensation- Base salary range: $120,000-$150,000, commensurate with experience and qualifications
- Total compensation includes equity in a rapidly growing start-up
