Position: Director of EngineeringLocation: Valley Green, PA Amphenol High Speed Products Group is the market leader for high speed, high bandwidth electrical connectors for the Telecom/Datacom market (Mobile Networks, Storage, Servers, Routers, Switches, etc.). Our products help to enable the electronics revolution and remain a key enabler for all the major Tier 1 OEMs globally. We have design, sales, and manufacturing locations globally and are currently seeking a Director of Engineering to join our Backplane OverPass Engineering team located in Etters, PA.
The Backplane OverPass Solutions Business Unit develops high-speed, high-bandwidth interconnect solutions for AI, cloud, networking, server, storage, and data-center platforms. Its portfolio includes advanced connectors, and flyover cable assemblies that move signals off traditional PCB traces to improve signal integrity, reduce loss and heat, and support next-generation system architectures. The business partners globally across engineering, manufacturing, sales, and customers to deliver scalable connectivity solutions for leading technology companies.
RESPONSIBILITIES: - Lead a multidisciplinary engineering team responsible for product development, mechanical and electrical design, program execution, and validation.
- Own the engineering lifecycle from concept through NPI to volume production.
- Drive program management and cross-functional alignment across engineering, operations, quality, and sales teams.
- Oversee signal integrity strategy, test development, and performance validation for high-speed interconnect products (e.g., 112G PAM4 and beyond).
- Interface directly with leading AI system and hyperscale customers to define interconnect solutions optimized for their architectures.
- Partner with business and product line leadership to define product roadmaps aligned with evolving AI workloads and system-level requirements.
- Champion a culture of technical excellence, execution rigor, and continuous improvement.
QUALIFICATIONS: - Bachelors or Masters Degree in Electrical Engineering, Mechanical Engineering, or related field; advanced degree preferred.
- 8+ years of engineering experience in high-speed interconnect, data center hardware, or AI system development.
- Deep familiarity with system-level architecture of AI clusters, including GPU-to-GPU, GPU-to-switch, and switch-to-switch connectivity.
- Proven leadership in managing multi-disciplinary teams across product development, signal integrity, and testing.
- Hands-on knowledge of high-speed electrical design, crosstalk mitigation, and compliance to emerging standards (e.g., PCIe, Ethernet, InfiniBand).
- Strong background working with system companies (e.g., NVIDIA, AMD, Broadcom, Intel, or hyperscalers) designing compute and networking systems for AI workloads.
- Demonstrated ability to lead complex engineering programs, meet aggressive timelines, and deliver high-quality products.
- Excellent communication and collaboration skills, especially in customer-facing engagements.
