Qualifications

• Degree in engineering or related field required; understanding of electronic devices is mandatory.
• Knowledge of semiconductor devices and package technologies essential; experience in failure analysis and field applications preferred.
• Strong analytical thinking and communication skills to engage stakeholders effectively.
• Experience with structured problem-solving methodologies like 8D desired.
• Familiarity with manufacturing engineering concepts, such as FMEA and OCAP, is advantageous.
• Understanding of quality management systems and standards (ISO 9001, IATF/VDA, QMS) preferred.
• Ability to navigate high-pressure situations and respond effectively.

Responsibilities

• Coordinate and support quality tasks for New Product Introductions and customer inquiries.
• Participate in customer audits to ensure compliance with industry standards.
• Build and sustain customer relationships through proactive communication.
• Manage Failure Analysis requests, provide interpretations, and communicate findings.
• Act as the primary contact for customer complaints, delivering timely analysis.
• Collaborate with internal teams to solve technical issues and promote continuous improvement.
• Willing to travel up to 25% of the time for business and customer needs.

Benefits

• Opportunity to work with advanced technology in a dynamic industry.
• Engagement in customer-facing roles that enhance relationship-building skills.
• Chance to lead quality initiatives in new product developments and audits.
• Access to professional development and continuous improvement processes.
• Involvement in technical problem-solving and operational excellence.