Marvell Technology

Advanced Package Design Senior Staff Engineer

Marvell Technology • $141K — $211K *
Telecommunications & Hardware
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor’s degree in Computer Science, Electrical Engineering, or related fields with 7+ years of experience OR Master’s/PhD with 5+ years
  • Proficient in high-speed electronic packaging for both digital and analog ICs
  • Experience with 2.5D/3D package development
  • Knowledge of materials and assembly rules for packaging technologies
  • Strong understanding of EM, transmission lines, and microwave theory
  • Basic proficiency with IC package floor planning and layout tools
  • Ability to automate SI, PI, and packaging activities using Python scripting

Responsibilities

  • Lead package development and electrical design activities
  • Optimize signal integrity, power integrity, and manufacturability
  • Evaluate package technologies and drive layout implementation
  • Collaborate with marketing and system architects to define package requirements
  • Develop achievable specifications for next-generation packaging technologies

Benefits

  • Employee stock purchase plan
  • Family support programs for work-life balance
  • Robust mental health resources
  • Recognition and service awards for contributions
  • Equity grants and annual refreshers to reward performance
Full Job Description

Your Team, Your Impact

Group Description
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, Marvell’s innovative technologies enable new possibilities and power the next generation of performance‑driven systems.

Within this ecosystem, Marvell’s central advanced packaging organization plays a critical role in delivering next‑generation connectivity and compute products. The organization brings deep expertise in architecture, package design, and electrical performance, including SI/PI to develop advanced IC packages that support high‑speed interfaces. This work directly shapes product performance, reliability, and time‑to‑market, making it a key contributor to Marvell’s overall technology leadership.

What You Can Expect

Marvell's Central Engineering team is seeking a highly motivated High-Speed IC Package Development Engineer to develop advanced microelectronic packaging solutions for next-generation semiconductor products supporting 448 Gb/s data rates and beyond.

In this role, the engineer will lead package development and electrical design activities, including floorplanning, netlist creation, and BGA map definition, while optimizing signal integrity, power integrity, performance, manufacturability, reliability, and cost.

The engineer will work closely with package operations teams to evaluate package technologies, drive layout implementation, and ensure designs meet product and manufacturing requirements. Partnering with marketing, system architects, and IC design teams, the engineer will define package requirements, develop achievable specifications, and contribute to the advancement of next-generation packaging technologies.

What We're Looking For

  • At least a Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 7+ years of related professional experience OR a Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 5+ years of experience.
  • Experience with high-speed electronic packaging for digital and analog ICs, package floor planning, netlist, schematic and BGA map development.
  • Experience with 2.5D/3D package development.
  • Knowledge of packaging technologies, materials, package substrate design rules and assembly rules
  • Ability to manage package design and development involving various cross functional teams like IC physical layout teams, Analog and Digital designers, SI/PI teams, thermal-mechanical teams, assembly development, and marketing.
  • Experience with CPC/CPO connectors is highly desired.
  • Basic proficiency with IC package floor planning tools like integrated system planner (ISP) and layout tools like APD
  • Strong fundamentals in EM, transmission lines and microwave theory and experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity is highly desired
  • Power plane design, modeling and analysis using tools like PowerSI, SIwave is highly desired
  • Ability to automate the SI, PI and Packaging activities using scripting tools like Python.
  • Track record of new product introduction from concept, through development and production is a plus.
  • A team player
  • Strong communication, presentation, and documentation skills

Expected Base Pay Range (USD)

141,150 - 211,400, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

This role is eligible to participate in Marvell's bonus and equity plans, including a new hire equity grant and annual equity refreshers, ensuring you are rewarded for your contributions and remain invested in the company's long-term success.

Additional Compensation and Benefit Elements

Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.

Interview Integrity 

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

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About Marvell Technology

Marvell Technology is a semiconductor company that designs and develops analog, mixed-signal, and digital signal processing integrated circuits. The company's product portfolio includes processors, connectivity, storage, and security solutions. Marvell's customers operate in various industries, including data center, enterprise, automotive, industrial, and consumer electronics. The company was founded in 1995 and is headquartered in Santa Clara, California.
Learn more about Marvell Technology
Size
6,729 employees
Market Cap
$30.6 billion
Industry
Net Income
-$277.3 million
Founded
2013
5 Year Trend
+14.2%
Revenue
$2.9 billion
NASDAQ

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