We are seeking a Thermal-Mechanical R&D Engineer to join our Global Thermal R&D Team. This position will contribute to the development, evaluation, and integration of advanced thermal technologies for semiconductor test applications.
The ideal candidate is a self-driven, hands-on engineer with strong thermal fundamentals who is comfortable taking ownership of complex and sometimes open-ended technical problems. This individual should be able to move from problem definition and first-principles analysis through modeling, experimentation, prototype development, and technical recommendations with limited day-to-day direction.
Relevant industry experience is highly desirable, with 5+ years of experience preferred. However, we value demonstrated engineering capability, curiosity, judgment, and initiative over any specific number of years of experience.
Experience in semiconductor thermal management, electronics cooling, or semiconductor test is highly desirable, but candidates from adjacent industries with strong thermal engineering backgrounds are also encouraged to apply.
Key Responsibilities- Develop and evaluate advanced thermal solutions for high-power semiconductor test applications.
- Investigate emerging thermal-management technologies and assess their applicability to current and future semiconductor test requirements.
- Contribute to the development of future thermal technologies and longer-term technical roadmaps.
- Independently structure and drive technical investigations from initial problem definition through analysis, experimentation, and recommendation.
- Apply fundamentals of heat transfer, thermodynamics, and fluid mechanics, together with modeling, simulation, experimentation, and engineering judgment, to solve complex thermal problems and evaluate design trade-offs.
- Develop analytical and simulation models to understand thermal behavior, predict performance, and guide engineering decisions.
- Design and execute experiments to characterize thermal components, interfaces, cooling technologies, and system-level performance.
- Design, build, instrument, and troubleshoot prototype hardware and thermal test setups.
- Analyze experimental and simulation results, correlate models with hardware performance, and use findings to improve designs and technical solutions.
- Collaborate with multidisciplinary engineering teams to integrate thermal technologies into semiconductor test systems and product architectures.
- Work with internal teams, customers, suppliers, universities, and external technology partners to evaluate technologies and solve technical challenges.
- Clearly communicate technical findings, design trade-offs, risks, and recommendations to both technical and non-technical stakeholders.
Required Qualifications- Bachelor's degree in Mechanical Engineering, Thermal Engineering, or a closely related technical field. Master's degree preferred.
- Strong engineering fundamentals in heat transfer, thermodynamics, and fluid mechanics.
- Demonstrated experience applying engineering fundamentals, analytical methods, modeling, or experimentation to solve thermal engineering problems.
- Hands-on engineering experience developing prototypes, experiments, thermal test setups, laboratory hardware, or similar systems.
- Demonstrated ability to structure and solve complex or open-ended technical problems where the solution or path forward may not initially be well defined.
- Ability to independently drive day-to-day technical activities with limited supervision, while proactively seeking alignment, expertise, and support when needed.
- Strong analytical, problem-solving, and technical communication skills.
- Ability to collaborate effectively across engineering disciplines and within a globally distributed R&D organization.
Preferred Qualifications- 5+ years of relevant industry experience in thermal engineering, product development, R&D, or a related engineering discipline.
- Experience with semiconductor thermal management, semiconductor test, electronics cooling, high-power electronics, servers/HPC, or other high-heat-flux applications.
- Experience with thermal/CFD modeling tools such as ANSYS, FloEFD, Icepak, or equivalent.
- Experience with MATLAB, Python, or similar tools for engineering analysis, modeling, automation, or data processing.
- Experience with design of experiments (DOE), experimental characterization, and correlation of analytical or simulation models with hardware data.
- Familiarity with semiconductor packaging, device thermal characterization, temperature-control systems, instrumentation, or semiconductor test equipment.
What We Are Looking ForBeyond specific technical qualifications, we are looking for an engineer who:
- Is self-driven, curious, and comfortable taking ownership of technical challenges.
- Enjoys working hands-on with hardware, instrumentation, prototypes, and experimental systems.
- Can take an ambiguous problem, break it down, identify the important unknowns, and determine a practical path forward.
- Knows when to use first-principles analysis, simulation, experimentation, or engineering judgment rather than relying on any single approach.
- Proactively identifies issues and opportunities while knowing when to seek input or alignment from others.
- Can balance technical performance with practical considerations such as robustness, manufacturability, reliability, cost, and system integration.
This role provides an opportunity to work at the intersection of advanced thermal management, semiconductor devices, semiconductor packaging, high-power electronics, and semiconductor test.
As device power densities and thermal challenges continue to increase, thermal capability is becoming an increasingly important enabler of future semiconductor test solutions. The Global Thermal R&D Team works on technologies intended to address these emerging challenges and help define future Advantest thermal capabilities.
The engineer in this position will have the opportunity to explore new technologies, develop and test concepts, solve challenging engineering problems, and influence the technical direction of future thermal solutions.
* The actual base pay offered will depend on factors such as relevant experience, skills, qualifications, geographic location, market data, and internal equity. Compensation decisions are made individually based on the specific role and candidate. Typically, new hires are not placed at the top of the salary range upon hire. In addition to base salary, Advantest provides a competitive total rewards package that may include bonus opportunities, health and welfare benefits, retirement programs, paid time off, and other company-sponsored benefits.
