THE ROLE:Join AMD's Data Center Platform Engineering Group (DPEG) Thermal Mechanical Engineering team and play a key role in shaping the future of AI computing. This team owns the end-to-end thermal architecture, validation, and deployment of AMD's industry-leading MI Series AI accelerators and data center GPU platforms. Engineers on this team work at the intersection of cutting-edge AI hardware, advanced cooling technologies, and large-scale data center infrastructure.
This is an opportunity to collaborate with world-class engineers across silicon design, board engineering, validation, manufacturing, and product development while helping bring next-generation AI products to market. The successful candidate will contribute to thermal innovation from concept through production and gain hands-on experience with advanced cooling technologies that power some of the most demanding computing workloads in the world.
The role offers a unique combination of hands-on laboratory work, thermal modeling, design analysis, and technology development in a fast-paced environment focused on solving complex engineering challenges and enabling AMD's AI roadmap.
THE PERSON:The ideal candidate is a collaborative and technically curious engineer with a passion for solving complex thermal challenges. They are comfortable working in cross-functional environments, taking ownership of their work, and thrive when balancing hands-on experimentation with analytical problem-solving.
Successful team members are self-starters who communicate effectively, execute against commitments, support their teammates, and continuously seek innovative solutions to emerging thermal and cooling challenges. Individuals who bring deep expertise in a specific thermal discipline while maintaining a team-first mindset tend to excel in this environment.
KEY RESPONSIBILITIES:- Design and develop thermal solutions supporting AMD's next generation of data center GPU and AI accelerator products.
- Collaborate with silicon, board, power, validation, manufacturing, and platform engineering teams to deliver innovative thermal-mechanical solutions from component to system level.
- Perform thermal validation activities including test planning, laboratory experimentation, data collection, and analysis.
- Contribute to thermal modeling and simulation efforts to support product development and design optimization.
- Investigate, evaluate, and advance emerging cooling technologies aligned with AMD's future product roadmap.
- Support product development activities from concept through commercialization and mass production.
- During the first several months, become familiar with AMD thermal design methodologies, tools, products, and development processes while contributing to active engineering projects.
- Over time, take ownership of critical thermal design and validation efforts, develop domain expertise, and become a key contributor to next-generation AI platform development.
PREFERRED EXPERIENCE:- Strong background in heat transfer, fluid dynamics, and electronics cooling technologies.
- Experience with thermal management solutions for high-performance computing, data center, server, or AI hardware environments.
- Experience using CFD tools such as Icepak, ANSYS AEDT, or similar simulation platforms.
- Knowledge of air-cooled and liquid-cooled thermal design methodologies.
- Experience with thermal laboratory testing, design of experiments (DOE), instrumentation, data acquisition, and data analysis.
- Experience developing liquid cooling solutions including cold plates, liquid interconnects, manifolds, and related cooling technologies.
- Familiarity with thermal design components such as thermal interface materials (TIMs), heat spreaders, heat sinks, vapor chambers, heat pipes, and fans.
- Experience with CAD tools such as SolidWorks or Creo.
- Exposure to scripting, automation, or data analysis tools including Python, MATLAB, C/C++, or similar languages.
- Internship, research, or industry experience related to data center infrastructure, semiconductor products, AI accelerators, GPUs, or hyperscale computing environments is highly desirable.
ACADEMIC CREDENTIALS:- Master's degree or PhD preferred in Mechanical Engineering.
- Advanced degrees in Aerospace Engineering, Chemical Engineering, Thermal Sciences, Fluid Mechanics, or related engineering disciplines with a strong thermal focus are also desired.
- Research focused on thermal management, fluid dynamics, electronics cooling, computational modeling, or related areas is preferred.
LOCATION: Austin, Texas
This role is not eligible for visa sponsorship.#LI-CS1Benefits offered are described: AMD benefits at a glance.
