Qualifications
Responsibilities
Benefits
Summary of Role:
The Testsite Design and Development role is responsible for designing, developing, and utilizing in-house
semiconductor test chips and test structures to characterize emerging technologies, generate actionable electrical
data, and accelerate technology and customer design enablement.
Essential Responsibilities:
• Design and develop in-house test chips, testsites, and test structures to characterize semiconductor
technologies and improve understanding of customer design and technology requirements.
• Define and implement chip-level and device-level structures that enable electrical measurement, technology
characterization, and development learning.
• Collaborate with technology development, design enablement, product, test, and manufacturing teams to
translate characterization needs into testsite requirements and silicon implementations.
• Evaluate and process internal and customer designs through design-to-mask readiness, including layout
review and applicable design-rule, verification, and release activities.
• Plan and execute electrical characterization and other relevant testing of fabricated test chips to quantify
device, interconnect, circuit, and technology behavior.
• Analyze silicon data, identify trends and performance gaps, and translate results into recommendations for
technology, model, design-rule, or testsite optimization.
• Iterate testsite and chip designs based on measured silicon results to improve learning efficiency,
measurement capability, and technology maturity.
• Document testsite architecture, design intent, measurement results, and key technical conclusions, and
communicate findings to cross-functional stakeholders.
Other Responsibilities:
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety &
Security requirements and programs.
• Work collaboratively on other projects and assignments as needed.
Required Qualifications:
• Education - Bachelor’s degree in Electrical Engineering, Computer Engineering, Applied Physics,
Microelectronics, or a related technical field.
• Experience - Relevant experience in semiconductor IC or test-chip design, technology development, device
characterization, product engineering, or a related field; minimum years of experience to be aligned with the
applicable GF career level and scoping guidelines.
• Skills - Working knowledge of semiconductor devices, integrated-circuit design or layout, electrical
characterization, and interpretation of silicon measurement data.
• Skills - Experience with semiconductor design and verification flows such as schematic capture, layout,
DRC/LVS, extraction, simulation, or design-to-mask release processes.
• Skills - Ability to analyze technical data, identify root causes and trends, and translate results into design or
technology improvements.
• Fluency in English - written and verbal.
Preferred Qualifications:
• Master’s degree or PhD in Electrical Engineering, Computer Engineering, Applied Physics, Microelectronics, or
a related field.
• Experience designing semiconductor test chips, process-control or characterization structures, or dedicated
technology-development testsites.
• Experience with industry-standard EDA environments and data-analysis tools used for IC design, verification,
characterization, and silicon debug.
GF Confidential – Need to know
• Understanding of CMOS process technology, device physics, parasitic effects, process variation, reliability,
and design-technology interaction.
• Experience working across design, process integration, characterization, modeling, PDK, test, or
manufacturing organizations.
• Project management skills, including the ability to innovate, execute solutions that matter, and navigate
ambiguity.
• Strong written and verbal communication skills.
• Strong planning and organizational skills.
Expected Salary Range
$85,000.00 - $146,000.00The exact Salary will be determined based on qualifications, experience and location.
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