Bachelor's degree or higher in Engineering, Materials Science, Chemistry, or related field.
Bilingual in English and Korean.
10+ years in package substrate development or technical marketing.
Proven experience leading substrate projects to mass production.
Deep knowledge of substrate processes and materials.
Hands-on experience with advanced substrate technologies.
Strong customer relationship management and communication skills.
Responsibilities
Provide technical support for customer development programs.
Resolve technical issues and stabilize performance at customer sites.
Identify and develop proof of concept opportunities through customer engagement.
Guide selection of BOM and substrate structures using LGIT solutions.
Lead design reviews and production readiness assessments.
Coordinate between customer engineering and LGIT teams.
Conduct regular customer meetings and technical presentations.
Benefits
Opportunities for professional development and training.
Engagement with leading semiconductor customers.
Involvement in cutting-edge substrate technologies.
Dynamic work environment with frequent customer interaction.
Potential for international travel to Korea for business reviews.
Full Job Description
Job Summary
Serve as the on-site technical lead for advanced package substrate programs with Apple in the U.S., driving issue resolution and alignment with our teams in Korea to deliver successful mass production launches. Job Description
1) Main Responsibilities
- Provide technical support for customer development programs (Mobile AiP, SiP, FC-CSP, RF).
- Resolve technical issues and drive performance stabilization at the customer.
- Identify and develop PoC opportunities through customer engagement.
- Guide BOM and substrate structure selection using LGIT technical solutions.
- Lead design reviews, TRA assessments, yield improvement, and production readiness.
- Coordinate between customer engineering and LGIT R&D, Process, Quality, and Manufacturing.
2) Others
- Conduct regular customer meetings and technical presentations.
- Collect customer VOC and market intelligence to shape technology roadmaps.
- Support technology promotions, exhibitions, and strategic customer engagements.
- Bachelor's degree or higher in Engineering, Materials Science, Chemistry, or a related field.
- Bilingual in both English and Korean
- - 10+ years in package substrate development, process or customer engineering, or technical marketing.
- Proven record of leading substrate projects through mass production.
- Experience supporting major semiconductor customers preferred.
- Deep knowledge of substrate processes, materials, structures, and design rules.
- Hands-on experience with ABF, ETS, Hybrid Stack-up, Cavity, Fine Pattern, and RF.
- Ability to translate customer requirements into technical solutions.
- Experience in NPI, yield improvement, and production transfer.
- Strong customer relationship management skills.
- Clear technical presentation and communication skills.
- Project management and problem-solving capability.
- MS Office (PowerPoint, Excel, Word).
- Six Sigma Green Belt or equivalent preferred.
- PMP or equivalent project management certification preferred.
Travel:
- On-site customer support with frequent customer engagement.
- Frequent travel to customer sites within the U.S.
- Periodic travel to Korea for engineering and business reviews.
What's On Offer
Apply online or feel free to contact us directly for more information about the opportunity. Due to the high volume of applicant, we regret to inform that only shortlisted candidates will be notified. Thank you for your understanding.
