Full Job Description
Renesas Electronics is seeking an enthusiastic, initiative-taking, and fast-learning Staff Failure Analysis Engineer to join our team in Palm Bay, Florida. In this role, you will play a critical part in product quality, yield improvement, and customer satisfaction by conducting in-depth root cause analysis on a wide variety of semiconductor products.
You will work closely with cross-functional teams-including Design, Product Engineering, Quality Assurance, and Foundry Operations-applying advanced analytical techniques and bench characterization to isolate, identify, and report on failure mechanisms.
Qualifications
• Experience & Education:
• Bachelor's degree in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field with a minimum of 8 years of related experience;
• Or a Master's degree with 6 years of related experience;
• Or a PhD with 3 years of related experience;
• Fabrication & Packaging Knowledge: Strong fundamental understanding of front-end semiconductor fabrication processes (CMOS, BCD, or analog/mixed-signal) and modern IC packaging technologies.
• Bench & Test Competency: Demonstrated proficiency in using standard bench test equipment (oscilloscopes, SMUs, power supplies, multimeters) to power up devices and characterize electrical fault symptoms.
• Schematic & Layout Literacy: Proven ability to read and interpret electrical circuit schematics, netlists, and physical layouts (e.g., Cadence Virtuoso, GDS viewers) to trace electrical paths to physical silicon coordinates.
• Analytical Techniques & Instrumentation: Direct hands-on experience across traditional failure analysis workflows:
• Package & Non-Destructive: Curve tracing, X-ray, and Scanning Acoustic Microscopy (SAM).
• Image-Based Fault Isolation: Photon Emission Microscopy (PEM/EMMI), OBIRCh, and thermal emission.
• Deprocessing Techniques: Wet chemistry/decap, mechanical polishing/lapping, and plasma etching.
Additional Information
Preferred Qualifications
• Advanced physical analysis experience utilizing Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDS/EDX), or Focused Ion Beam (FIB).
• Experience with analog, power management, or mixed-signal IC architectures.
• Familiarity with industry quality standards (AEC-Q100, JEDEC) and formal problem-solving methodologies (8D, 5 Whys).
• Strong communication skills with the ability to articulate complex technical failure mechanisms to both engineering teams and non-technical stakeholders.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
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