Tenstorrent is building a high-performance AI platform that brings together software, compilers, platforms, networking, and semiconductors. The team values collaboration, curiosity, and solving hard problems. We are seeking a Staff Thermal Design Engineer to architect and productize advanced cooling solutions for high-performance PCIe cards and multi-chip server systems. You will lead thermal strategy for next-generation AI platforms, with a focus on complex liquid-cooling infrastructure and scalable product integration.
This role ishybrid, based out of Toronto, Canada.
We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.
Who You Are- You hold a bachelor's or master's degree in Thermal Engineering, Mechanical Engineering, or a related technical field, and have 10+ years of thermal design and architecture experience in enterprise servers, HPC, or specialized AI hardware.
- You have hands-on experience designing and deploying server-to-rack liquid-cooling systems, with deep knowledge of CDUs, manifolds, pumps, chillers, heat exchangers, cold plates, facility water loops, and quick disconnects.
- You are highly proficient in thermal simulation tools such as Ansys IcePak, FloTHERM, or SOLIDWORKS Flow Simulation, and 3D CAD tools, preferably SolidWorks.
- You bring expertise in airflow management and hybrid cooling, including vapor chambers, heat pipes, fans, and advanced thermal interface materials, as well as hands-on lab validation using environmental chambers, wind tunnels, and liquid-cooling flow testers.
- You are familiar with Longwin thermal testing equipment and tools such as data loggers, pressure-decay analyzers, flow meters, and airflow measurement systems; you balance thermal performance with manufacturability, cost, and reliability and can travel internationally up to 10% of the time.
What We Need- Architect and validate thermal solutions for high-power AI computing systems, including dense PCIe cards, multi-chip servers, and rack-level environments; define scalable approaches for integrating liquid cooling with air-cooled and hybrid thermal paths.
- Lead CFD simulation at chip, system, and rack levels, and guide design of cooling components and interfaces, including cold plates, manifolds, TIMs, vapor chambers, heat pipes, pumps, and fans.
- Define and oversee product-level validation and reliability strategies, including thermal cycling, environmental testing, leak detection, pressure-decay analysis, flow testing, and long-term thermal stability.
- Lead supplier and manufacturing engagements: establish mechanical and thermal requirements, review designs and tooling, validate supplier test plans, and support critical builds, prototype testing, and manufacturing qualification on site as needed.
- Drive thermal design reviews, engineering best practices, and future cooling roadmaps; mentor engineers, manage thermal component integration and lifecycle data in PLM, and produce clear architecture specifications, test reports, and design guidelines.
What You Will Learn- How to shape thermal architecture for next-generation AI platforms, from high-power PCIe cards and multi-chip servers to rack-scale systems.
- How to bring advanced liquid cooling together with air and hybrid cooling technologies in products designed for performance, reliability, and scalable manufacturing.
- How thermal simulations, lab validation, supplier development, and product integration work together to take complex cooling solutions from architecture through production.
- How to influence future AI cooling strategies and technical standards while working across thermal, mechanical, electrical, manufacturing, and supplier teams.
