Bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field, or equivalent experience.
6 years of experience in manufacturing process development in semiconductor packaging or Surface Mount Technology (SMT).
Proficient in SMT manufacturing processes and Design of Experiments for process development.
Experience in process improvement initiatives.
Preferred: Master's degree or PhD in relevant fields such as Electrical Engineering or Physics.
Preferred: Experience in advanced IC packaging qualifications and mechanical thermal dynamics.
Preferred: Proven track record in delivering innovative manufacturing solutions and overseeing yield improvements.
Responsibilities
Collaborate with design engineering on New Product Introduction (NPI) roadmaps and strategies with manufacturing partners.
Lead manufacturing process development and validation for new technologies and materials.
Develop and deliver comprehensive manufacturing documentation for NPI.
Work with cross-functional teams to identify value engineering opportunities and ensure manufacturability.
Coordinate with manufacturing partners to ensure build readiness and resolve complex design and manufacturing issues.
Benefits
Comprehensive health and wellness programs.
Generous paid time off and holidays.
Retirement savings plans with company matching.
Equity options and performance bonuses.
Access to professional development resources and training.
Full Job Description
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, a related field, or equivalent practical experience.
6 years of experience in manufacturing process development in semiconductor packaging or Surface Mount Technology (SMT).
Experience in SMT manufacturing processes, thermal mechanical, and process development via Design of Experiments and applied Design for Manufacturability.
Experience in Process Improvement.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
Experience in advanced IC packaging qualifications, metallurgy, and mechanical thermal dynamics.
Experience delivering innovative manufacturing solutions, leading failure analysis investigations and resolutions, and overseeing yield improvements for high complexity products.
Knowledge of industry trends, emerging technologies, and engaged landscape in manufacturing processes.
About the job
As an Electrical Manufacturing Engineer for the New Technology Introduction process, you are an integral part of the Physical Infrastructure Engineering (PIE) team. You will join the team that is responsible for releasing Google's hardware to mass production and developing a supply chain to deliver it. You will lead the development and scale of new PCBA manufacturing and materials technologies to enable the growing roadmap of Google Cloud data center products. You will be the technical expert for advanced manufacturing processes and provide technical leadership for the delivery of approaches and processes for our product development efforts.
In this role, you will work cross-functionally to influence technology direction and adoption for our data center products. You will also ensure that our supply chain stack is fully readied to execute novel manufacturing and test approaches in production environments.Our Platforms Infrastructure Engineering team designs and builds the hardware and software technologies that power all of Google's services. Our computational challenges are complex and unique, enabled by cutting-edge custom hardware designed and made in-house. As a hardware engineer, you will design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You will see those systems from concept all the way through to high-volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers, affecting millions of Google users.Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
Collaborate with design engineering on NPI roadmaps, develop strategy and plans to enable New Products Introduction with our manufacturing partners.
Lead overall manufacturing process development and validation including novel technologies, materials, and processes, to systematically identify and establish manufacturable and scalable manufacturing processes.
Develop and deliver manufacturing documentation (e.g., Engineering Bill of Materials, Assembly Drawings, Manufacturing Work Instructions, etc.) in support of New Product Introduction.
Collaborate with design and cross-functional engineering teams throughout NPI phases to identify value engineering opportunities, ensure Design for X (Dfx) and manufacturability.
Work closely with manufacturing partners in build readiness, process development, process validation, solve complex design and manufacturing issues efficiently to meet project timing and ensure flawless NPI launch.
About Google
Google is a multinational technology company that specializes in Internet-related services and products. These include online advertising technologies, search engine, cloud computing, software, and hardware. Google was founded in 1998 by Larry Page and Sergey Brin while they were Ph.D. students at Stanford University. The company has grown tremendously since then and has become one of the most valuable companies in the world. Google's mission is to organize the world's information and make it universally accessible and useful.
