Position Summary We are seeking a hands-on Senior Packaging Failure Analysis Engineer to lead root-cause investigation of complex failures across our silicon photonics, MEMS, optical packaging, and electronic assemblies.
This role will have a particular focus on cross-sectioning bonded components and analyzing material interfaces, including adhesive/epoxy attach, fusion and eutectic bonding, solder interconnects, and hermetic packages. The ideal candidate combines a strong foundation in materials science and interfacial phenomena with deep practical experience in failure analysis, microscopy, analytical characterization, and sample preparation.
You will own investigations from initial non-destructive analysis through destructive physical analysis, determine the appropriate characterization technique for each problem, translate findings into actionable root cause and corrective actions, and feed learnings back into product design, packaging, manufacturing, and supplier processes.
Over time, this individual may also play a key role in building and expanding in-house failure analysis capabilities, including cross-sectioning/polishing, microscopy, SEM/EDS, and related analytical infrastructure.
Key Responsibilities- Collaborating with other nEye groups to optimize chip design for product system-level requirements
- Driving specific device designs and collaborating on fabrication methodologies.
- Designing photonic components and photonic integrated circuits to advance our optical switch technology.
- Developing, overseeing, and performing photonic component and system-level testing.
- Working cross-functionally with system and fabrication team members to develop improved optical switch capabilities.
Required Skills & Qualifications- PhD degree in Electrical Engineering, Materials Science, Applied Physics, Chemistry, or a related technical discipline.
- 1-4 years of hands-on experience with Si Photonics
- Strong understanding of microfabrication processes and related constraints on photonic component designs.
- Strong understanding and proficient experience of photonic component simulation tools such as FDTD, EME, FEM, or FIT.
- Strong proficiency in Python
- Experience with photonic integrated circuit layout and photonics foundry tape-out.
- Experience with designing and executing detailed photonic device experiments and characterization protocols.
- Strong communication skills in collaboration, verbal presentation, and written reports.
- Excellent interpersonal, communication (written and oral), and leadership skills.
$135,000 - $180,000 a year
Starting salary and title will depend on, and be commensurate with, relevant experience, skills, training, education, market demands, and the ultimate job duties and requirements.
