Piper Companies is seeking a Senior Substrate Design Layout Engineer to support an industry-leading semiconductor organization for a permanent, onsite opportunity based in Saratoga, CA. The Senior Substrate Design Layout Engineer will contribute to the development and layout of cutting-edge organic substrate solutions for next-generation multi-die and chiplet computing platforms.
Responsibilities of the Senior Substrate Design Layout Engineer include:
• Lead detailed layout activities for complex organic substrates, including bump planning, routing schemes, and multilayer stack-up development.
• Define routing and power-delivery strategies that support high-speed interfaces and high-current architectures across advanced package substrates.
• Collaborate closely with integration, silicon, SI/PI, and mechanical teams to ensure cohesive co-design and layout feasibility.
• Evaluate design risks early in development and recommend layout-driven improvements to meet electrical, mechanical, and manufacturability constraints.
• Interface with substrate suppliers and OSAT partners to validate design readiness, manufacturability, and overall yield performance.
Qualifications for the Senior Substrate Design Layout Engineer include:
• 10+ years of experience in advanced organic substrate design or high-performance IC package layout.
• Background working with multi-die, chiplet, or high-density module architectures using ABF and multilayer organic technologies.
• Proficiency in Siemens Xpedition (preferred) and experience with tools such as Cadence Allegro/APD.
• Hands-on experience collaborating with OSATs and global substrate vendors, including driving designs through tape-out.
• Strong understanding of SI/PI concepts, HDI structures, and routing practices supporting high-speed signals and advanced power delivery networks.
Compensation for the Senior Substrate Design Layout Engineer:
Salary Range: $235,000-$265,000/year (USD)
Comprehensive Benefits: Medical, Dental, Vision, sick leave if required by law, and 401K
This job opens for applications on 10/16/26. Applications for this job will be accepted for at least 30 days from the posting date.
Keywords: substrate design, organic packaging, advanced packaging, chiplet integration, multi-die modules, ABF substrates, Siemens Xpedition, Allegro APD, OSAT, HDI routing, SI/PI, high-speed interfaces, power delivery networks, PCB layout, co-design, semiconductor packaging, bump planning, escape routing, stack-up design, manufacturability, high-density routing, tape-out.
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