Job Posting Title:Senior/Staff Advanced Packaging Materials Engineer, Texas Institute for Electronics
----Hiring Department:Texas Institute for Electronics
----Position Open To:All Applicants
----Weekly Scheduled Hours:40
----FLSA Status:To Be Determined at Offer
----Earliest Start Date:Ongoing
----Position Duration:Expected to Continue
----Location:AUSTIN, TX
----Job Details:General NotesPurposeResponsible for developing new formulations and evaluating current materials used in our advanced packaging products. Work closely with process development and other related internal teams and external vendors to define and create material candidates and potential material-based solutions. Responsible for developing a comprehensive testing and characterization plan for internally developed and externally acquired materials.
Responsibilities- Drive material formulation, characterization, and process optimization through structured Design of Experiments (DOE), data analysis, and root-cause investigations.
- Design and execute experiments to evaluate material properties, process performance, reliability, and compatibility with advanced packaging technologies, including 2.5D/3D integration, heterogeneous and mixed material integration, and hybrid bonding.
- Lead material qualification and performance validation, and qualification of innovative material solutions for advanced semiconductor packaging applications.
- Collaborate with cross-functional teams, including process engineering, equipment development, manufacturing, and external partners, to integrate new materials into semiconductor packaging processes.
- Serve as a technical subject matter expert, engaging with customers, suppliers, and industry partners to translate technical requirements into material specifications, development roadmaps, and commercially viable solutions.
- Able to work in a team environment, mentor junior engineers / students and communicate effectively.
- Other duties as assigned.
Required QualificationsSenior Engineer:- Bachelor's degree in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline and two years of experience in semiconductor packaging industry or a closely related industry, or
- Master's degree or higher in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline.
Staff Engineer:- Bachelor's degree in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline and five years of experience in semiconductor packaging industry or a closely related industry, or
- Master's degree in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline, and three years of experience in semiconductor packaging industry or a closely related industry, or
- Ph.D. higher in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline.
For all levels:- Experience in semiconductor packaging industry or a closely related industry.
- Prior hands-on experience in semiconductor packaging materials development, process integration, or related manufacturing technologies, with a solid understanding of industry requirements and technical challenges.
- Strong understanding of advanced semiconductor packaging architectures and technologies, including 2.5D/3D integration, heterogeneous integration, chiplets, wafer-level packaging, and hybrid bonding.
- In-depth knowledge of polymer chemistry, structure-property relationships, adhesion mechanisms, interfacial science, thermal and mechanical properties, and material reliability.
- Proficiency in materials characterization and analytical techniques, such as DSC, TGA, DMA, FTIR, TMA, etc and mechanical testing, with the ability to interpret results and establish material-performance relationships.
- Demonstrated ability to independently design and execute experiments, apply Design of Experiments (DOE) methodologies, troubleshoot complex technical challenges, and translate research findings into practical engineering solutions.
Relevant education and experience may be substituted as appropriate.
Preferred Qualifications- Ph.D. in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline.
- 3 or more years of experience in semiconductor packaging industry or a closely related industry.
- Two or more years of experience working on Temporary Bonding and Debonding (TBDB) materials and processes.
- Experience in a startup or research and development (R&D) environment.
Salary Range TIE Pays Industry Competitive Salaries
Work Schedule- Monday - Friday (specify if schedule is 8am to 5pm, or flexible between 7am and 6pm, etc.)
Working Conditions- Work is performed on-site in a scientific research environment and prototyping facility with dynamic work conditions collaborating simultaneously with many partners/customers in parallel.
- Work outside standard office hours could be required on an occasional basis during peak periods and special events.
- May work around standard office conditions
- Repetitive use of a keyboard at a workstation
- Use of manual dexterity (ex: using a mouse)
Required Materials - Resume/CV
- 3 work references with their contact information; at least one reference should be from a supervisor
Importantfor applicants who are NOT current university employees or contingent workers: You will be prompted to submit your resume the first time you apply, then you will be provided an option to upload a new Resume for subsequent applications. Any additional Required Materials (letter of interest, references, etc.) will be uploaded in the Application Questions section; you will be able to multi-select additional files. Before submitting your online job application, ensure that ALL Required Materials have been uploaded. Once your job application has been submitted, you cannot make changes.
Important for Current university employees and contingent workers: As a current university employee or contingent worker, you MUST apply within Workday by searching for Find UT Jobs. If you are a current University employee, log-in to Workday, navigate to your Worker Profile, click the Career link in the left hand navigation menu and then update the sections in your Professional Profile before you apply. This information will be pulled in to your application. The application is one page and you will be prompted to upload your resume. In addition, you must respond to the application questions presented to upload any additional Required Materials (letter of interest, references, etc.) that were noted above.
Employment Eligibility:Regular staff who have been employed in their current position for the last six continuous months are eligible for openings being recruited for through University-Wide or Open Recruiting, to include both promotional opportunities and lateral transfers. Staff who are promotion/transfer eligible may apply for positions without supervisor approval.
Retirement Plan Eligibility:The retirement plan for this position is Teacher Retirement System of Texas (TRS), subject to the position being at least 20 hours per week and at least 135 days in length. This position has the option to elect the Optional Retirement Program (ORP) instead of TRS, subject to the position being 40 hours per week and at least 135 days in length.
Background Checks:A criminal history background check will be required for finalist(s) under consideration for this position.
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