Strong troubleshooting skills in semiconductor packaging and manufacturing environments
Success in qualifying processes like flip-chip bonding and wafer processing
Expertise in statistical quality control and continuous improvement methodologies
Comfortable in cleanroom settings and cross-functional teams
Willingness to work extended hours and weekends as needed
Responsibilities
Own development of wafer prep and die-level packaging processes, including bumping and dicing
Select tools, materials, and develop recipes for volume production
Translate designs into high-volume production processes, collaborating with design teams
Design processes from lab bench to production ramp
Establish process limits and feedback constraints for design teams
Characterize parts using advanced testing methods and support design teams
Act as technical owner for failure analysis and corrective actions
Optimize process yields and reliability for long-term qualification
Provide technical mentorship to teams building semiconductor packaging processes
Benefits
Eligibility for long-term incentives including stock options and performance-based bonuses
Comprehensive medical, vision, and dental insurance at low cost to employees
Paid parental leave and flexible PTO including three weeks vacation
Access to 401(k) retirement plan
Relocation assistance to Los Angeles
Full Job Description
SENIOR PROCESS ENGINEER
Our products require semiconductor-grade packaging processes-bumping, dicing, precision bonding, optical alignment, and automated assembly-executed at yield levels and volumes that demand real process engineering discipline. We are seeking a Senior Process Engineer to own the development and qualification of these processes from R&D through production ramp, and to help build high-volume semiconductor packaging process engineering in the US.
RESPONSIBILITIES
Own development of wafer prep and die-level packaging processes: bumping, dicing, sub-micron precision bonding, sub-micron optical alignment, flip-chip die bonding, wire-bonding, dispense, fully-automated final assembly and associated materials
Own tool selection, materials selection, recipe development, and statistical process control limits to transfer processes from R&D to volume production
Translate package and product designs into high volume production processes and collaborate with electrical, mechanical, and photonic circuit design teams to design-for-manufacturing
Design production processes from the lab bench through proof of concept and production ramp
Establish process limits and feedback process constraints as design rules to design teams
Characterize parts with x-ray, FIB cut/SEM, CSAM, and die shear testing, closing the loop with electrical, mechanical, and photonic circuit design teams
Act as the technical owner for failure-analysis findings, root cause analysis, and corrective actions
Push process yields above 99.9% and thermal-cycle reliability for years-long qualification
Provide technical mentorship as we work to build up high-volume semiconductor packaging process engineering in the US
QUALIFICATIONS
MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, or similar
Strong troubleshooting skills and hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments
Demonstrated success qualifying processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bonding
Expertise in statistical quality control and process improvement methodologies, with experience leading internal audits and driving continuous improvement
Comfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams
Willingness to work extended hours and weekends as needed
PREFERRED EXPERIENCE
5+ years of fab or wafer level packaging experience (e.g. lithography, etch, CVD, CMP, solder bumping, wafer dicing)
Experience integrating photonic devices into complex opto-electronic packages, sub-µm die-bonding, wafer prep, and materials used in advanced packaging
COMPENSATION AND BENEFITS:
Pay range: Senior Process Engineer: $140,000.00 - $180,000.00/per year
Title and base salary are determined on a case by case basis commensurate with experience and merit.
In addition to base salary, compensation for this role includes:
Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements.
Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents.
Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).
