Bachelor's Degree in Engineering (Electrical, Mechanical, Material Science, or related field) preferred
10+ years in Assembly Process Engineering, preferably hands-on with Die Attach, Wire Bond or Mold
Advanced understanding of Semiconductor processes
Hands-on experience in Semiconductor Back End Process Engineering essential
Familiarity with AutoCAD or Solidworks preferred
Experience with Statistical Process Control, Design of Experiments & FMEA highly desirable
Must be a US Citizen for military and aerospace program work
Responsibilities
Support Customer and Sales Group in process and materials selection based on requirements
Engage directly with customers on technical issues and specification reviews
Manage Assembly Processes for specific Products/Customers
Conduct Design of Experiments on new IC Assembly Processes
Provide clear yield reporting through DOE, SPC, and analysis
Collect and analyze yield data from production equipment and customer products
Document experimental findings and process procedures thoroughly
Evaluate and recommend new equipment for production enhancements
Conduct root cause analysis for process failures
Identify and implement improvements in cost, quality, and yield
Be flexible to perform additional duties as assigned
Benefits
Opportunities for professional growth within the semiconductor and engineering field
Engagement with cutting-edge technology in IC assembly processes
Direct interaction with customers and partners in the semiconductor industry
Contribution to projects involving sensitive military and aerospace programs
Collaborative work environment with other engineering experts
Full Job Description
Position Title: Senior Process Engineer
Reports To: General Manager
Department Name: Assembly Engineering
Location:Silicon Valley
Summary:
The Senior Process Engineer will perform IC Assembly process development and improvement directly resulting in increased efficiency and quality on the production floorThis will be achieved through process documentation, operator training, and design of experiments
Essential Duties & Responsibilities:
Assembly Engineering support for the Customer and Sales Group to review Customer requirements, and determine the correct process and materials to meet those requirements.
Daily interaction directly with customers with regard to technical issues and specification reviews.
Manage and define Assembly Processes relating to specific Products and/or Customers.
Responsible for conducting thorough Design of Experiments on new IC Assembly Processes with the goal of developing processes and enhancing productivity.
Provide DOE, SPC, and yield reporting in a clear and presentable format.
Collect Assembly yield data and perform yield analysis for production equipment and customer products.
Generate detailed reports and specifications documenting all experimental and process findings and procedures.
Assess existing processes and identify areas of improvement and solutions for these systems.
Evaluate and provide recommendations on new equipment that will enhance the current production capabilities.
Conduct root cause analysis and corrective actions related to process failures.
Identify and implement cost, quality, and yield improvements.
Flexible to perform other duties as assigned.
Other Duties & Responsibilities:
Perform or assist with any operations to maintain workflow, meet schedules and meet quality requirements.
Maintain safe work areas, comply with safety procedures, and follow equipment operating rules.
Follow clean room and other environmental precautions and procedures.
Participate in meetings and work groups to facilitate cross functional activities, communicate issues, obtain approvals, resolve problems, and maintain knowledge of new developments, requirements, and policies.
Comply with all quality and ITAR policies, practices, and procedures.
Participate in team efforts to achieve departmental and company goals.
Contribute to building a positive team spirit.
Communicate effectively with all levels of employees.
Protect confidential information by not communicating, disclosing, or using for benefit of 3rd parties.
Maintain the highest degree of honesty and integrity at all times.
Perform other related duties as assigned.
JOB REQUIREMENTS INCLUDE (List as required or preferred)
Education: Bachelor's Degree in Engineering, Electrical, Mechanical, Material Science, or related field preferred;
Experience:
Advanced understanding of Semiconductor processes.
Hands-on Experience in Semiconductor Back End Process Engineering required.
Hands-on Experience in wafer thinning, dicing, die-attach, flip chip, and wire bonding preferred
Knowledge/Skills:
10 years of Assembly Process Engineering experience, preferred Hands on in Die Attach, Wire Bond or Mold
Knowledge of basic AutoCAD or Solidworks preferred.
Statistical Process Control, Design of Experiments & FMEA experience are all highly desirable.
Detail-oriented, data entry accuracy, problem solver, good analytical skills, team player, multitask capability
General computer skills, including Microsoft Office Suite.
Strong written and verbal communication skills.
Citizenship: Must be a United States Citizen in order to work on sensitive military and aerospace programs.
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SUPERVISORY RESPONSIBILITIES
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