Job's missionRole OverviewThe Senior Principal Electrical Engineer is the highest-level technical authority for electrical architecture and technology strategy across advanced packaging semiconductor equipment platforms. This role defines long-term electrical technology roadmaps, drives cross-business innovation, governs system architecture decisions, and serves as the subject matter expert for RF systems, controls, power delivery, EMC/EMI, grounding, functional safety, and next-generation tool development.
Key Responsibilities - Own enterprise-level electrical architecture strategy across multiple semiconductor equipment platforms.
- Define technology roadmaps for RF power systems, power distribution, motion control, safety systems, sensors, and advanced electronics.
- Lead architecture governance and executive design reviews (SRR, PDR, CDR).
- Drive innovation, intellectual property creation, and technology differentiation.
- Provide technical leadership for critical customer escalations and complex field issues.
- Establish electrical engineering standards, design methodologies, and best practices.
- Lead cross-functional teams spanning systems, process, mechanical, software, manufacturing, and suppliers.
- Own EMC/EMI, grounding, CE/UL, SEMI, and global compliance strategies.
- Mentor principal engineers and develop organizational technical capability.
- Influence product strategy, new platform development, and corporate technology investments.
Required Qualifications - MS or PhD in Electrical Engineering or related discipline preferred.
- 15+ years of semiconductor capital equipment experience.
- Recognized expert in RF systems, power electronics, motion control, safety systems, or tool electrical architecture.
- Extensive experience leading complex, multi-disciplinary technology programs.
- Deep knowledge of SEMI standards, CE/UL, EMC/EMI, grounding, and safety compliance.
- Demonstrated technical leadership across multiple product generations.
Preferred Qualifications - Advanced packaging, plasma processing, etch, deposition, or wafer-level packaging experience.
- Strong patent portfolio and innovation track record.
- Experience defining product roadmaps and technology strategy.
- Industry-recognized technical leadership and customer engagement experience.
