B.S., M.S., or Ph.D. in Electrical Engineering, Optoelectronics, Optics, or Applied Physics with 7+ years of relevant experience.
Familiarity with industry standards for optical modules (IEEE, QSFP-DD, OSFP, CMIS).
Proficiency in PCB design and analysis tools.
Hands-on experience with high-speed optical and electrical test equipment, including optical alignment and manufacturing-floor equipment.
Experience developing PCBs for 800Gbps or 1.6Tbps optical transceiver modules is preferred.
Responsibilities
Review PCB requirements and layouts with cross-functional teams, focusing on high-speed routing and SI/PI-driven strategies.
Perform PCB bring-up, debugging, and characterization using advanced testing tools and simulations for high-speed module architectures.
Support new product introduction (NPI) and mass production, ensuring manufacturability and reliability.
Coordinate electrical-optical system integration, defining interfaces for optical components to maintain signal integrity.
Collaborate with various teams to optimize PCB designs for thermal and mechanical constraints, and develop system-level test plans.
Benefits
Discretionary bonus eligibility.
Equity options available.
Comprehensive medical benefits.
Additional benefits not specified.
Full Job Description
Job description
Credo is seeking an Senior Optical Hardware Engineer to join our Zero Flap optical module development team at our San Jose headquarters. In this role, you'll validate and debug optical modules operating at 212.5 Gbps (PAM4) and beyond, applying your expertise in signal and power integrity to ensure optimal performance and readiness for high-volume production. You'll partner with cross-functional teams and industry partners to advance Credo's Zero Flap optical products from prototype through mass manufacturing-playing a critical role in shaping the next generation of high-speed optical interconnects.
Base salary range is $140,000 - $210,000 a year. The base salary offer will depend on factors such as education, experience, training, skills, qualifications, and location. This position is also eligible for a discretionary bonus, equity and a full range of medical and other benefits.
Qualifications
Basic Qualifications
B.S., M.S., or Ph.D. in Electrical Engineering, Optoelectronics, Optics, or Applied Physics, with 7+ years of relevant experience.
Familiarity with industry standards governing optical modules (IEEE, QSFP-DD, OSFP, CMIS).
Proficiency with PCB design and analysis tools.
Hands-on experience with high-speed optical and electrical test equipment, and familiarity with optical alignment and manufacturing-floor equipment, with strong skills in analyzing alignment data.
Preferred Qualifications
Experience developing PCBs for 800Gbps or 1.6Tbps optical transceiver modules.
Familiarity with optical component manufacturing technologies and the industry landscape.
Experience leading and contributing to cross-functional teams.
Job responsibilities
Review PCB requirements, interfaces, and constraints with mechanical, firmware, optical, and manufacturing teams, and review PCB layouts, including component placement, stack-up design, high-speed routing, controlled impedance paths, and SI/PI-driven layout strategies.
Perform PCB bring-up, debugging, and characterization using oscilloscopes, VNAs, and power analysis tools, and review SI/PI simulations and modeling reports (channel analysis, PDN optimization, high-speed data path modeling) for 1.6Tbps+ module architectures.
Support NPI and mass production, ensuring manufacturability, yield, reliability, and DFM compliance, and partner with manufacturing teams on production readiness and timely issue resolution.
Coordinate electrical-optical system integration for high-speed modules, aligning PCB architecture with optical engine requirements; define electrical interfaces for optical components (drivers, TIAs, DSPs/Coherent ASICs, lasers, photodiodes) to ensure signal integrity across the optical chain; and support integration of optical subassemblies (ROSAs, TOSAs, Coherent Optical Engines), including connector selection, power delivery, and high-speed interface routing.
Collaborate with optical, mechanical, packaging, and supplier teams to co-optimize PCB designs for thermal paths, mechanical constraints, fiber routing, and optical engine placement; debug electrical-optical performance issues (modulation errors, link margin, thermal drift, eye diagrams, interface compatibility); develop system-level test plans validating performance against industry standards (IEEE, OIF, MSAs); and ensure seamless integration across firmware, DSP/ASIC behavior, power regulation, clocking, and optical performance.
