Master's Degree in Engineering (Materials, Electrical, Mechanical, or Physics)
8+ years of hands-on experience in microelectronics packaging and process engineering
Deep expertise in Flip Chip and Wire Bonding processes
Strong understanding of material interactions including underfills and epoxies
Proficiency in programming automated assembly equipment.
Responsibilities
Define assembly strategies for optoelectronic modules
Lead development of key process recipes such as Flip Chip and Wire Bonding
Research and procure capital equipment, overseeing acceptance testing
Provide DFx guidance to optimize yield and reliability
Drive design of custom tooling and fixtures for assembly
Act as primary technical liaison with customers during development
Implement robust process controls and conduct root cause analysis.
Benefits
Work on cutting-edge technologies that shape future connectivity
Located in Kanata, Ontario, Canada's tech hub
Opportunity to influence engineering culture and technical direction.
Full Job Description
Job Purpose
We are seeking an industry expert to lead the process architecture and development for our next-generation optical and microelectronic process solutions.
In this pivotal role, you will act as the technical anchor for our product solutions team. You will not simply run processes; you will define the assembly strategy from the ground up. Bridging the gap between R&D and high-volume manufacturing, you will own the end-to-end process lifecycle-from initial concept and recipe development to equipment selection and final release-to-manufacturing.
If you are a hands-on expert in flip-chip, wire bonding, and advanced optical packaging who thrives on solving complex device physics challenges, we want you to lead our technical vision.
Key Responsibilities
Process Architecture & Development
Define the Strategy: Conceptualize and develop comprehensive assembly strategies for complex optoelectronic modules, ensuring alignment with device physics, thermal requirements, and throughput goals.
Advanced Packaging Execution: Lead the hands-on development of critical process recipes, including Flip Chip, Underfill, Die Attach (epoxy & eutectic AuSn), and Wire Bonding (ball/wedge).
Equipment Leadership: Research, specify, and procure capital equipment. Oversee acceptance testing (SAT/FAT) to ensure new capabilities meet technological roadmaps.
NPI & Design for Manufacturability (DFx)
Design Partnership: Act as the primary feedback loop to the internal design team and external customers. Provide expert DFx (Design for Assembly/Manufacturing) guidance to optimize yield and reliability before prototypes are built.
Tooling & Fixturing: Conceptualize and drive the design of custom tooling and fixtures required for novel assembly techniques.
Customer Interface: Serve as the primary technical liaison for customers during the development phase, translating their requirements into viable manufacturing processes.
Quality, Analysis & Control
Rigorous Methodology: Implement robust process controls using PFMEA and Control Plans.
Root Cause Analysis: Lead complex troubleshooting efforts using methodical approaches (8D, etc.) to resolve yield excursions or performance issues.
Documentation: Author and approve high-level process assembly documentation and process qualification reports.
Mentorship & Leadership
Technical Mentorship: Act as a subject matter expert and mentor to junior and intermediate engineers, fostering a culture of technical excellence and best practices.
Project Management: Manage engineering timelines and milestones to ensure customer NPI builds are delivered on schedule.
Required Experience & Education:
Master's Degree in Engineering (Materials, Electrical, Mechanical, or Physics).
Minimum8+ years of direct, hands-on experience in microelectronics packaging and process engineering.
Core Competencies: deep expertise in Flip Chip and Wire Bonding (Chip & Wire) processes is non-negotiable.
Material Science: Strong understanding of material interactions, including underfills, epoxies, and gold-tin (AuSn) soldering/reflow processes.
Technical Skills:
Proficiency in programming automated assembly equipment (pick-and-place, dispensers, wire bonders).
Demonstrated experience driving Engineering Change Orders (ECOs) and process qualifications.
Strong background in statistical process control (SPC) and data analysis.
Preferred Assets:
Experience specifically within the Photonics/Microelectronics sector.
Proficiency with CAD tools (AutoCad, SolidWorks) for tooling design.
Knowledge of Lean Manufacturing and Six Sigma principles.
Why Join Us?
Impact: Work on cutting-edge technologies that are shaping the future of connectivity.
Location: Based in the heart of Canada's tech hub in Kanata, ON.
Growth: A visible role with the opportunity to shape the engineering culture and technical roadmap of the organization.
OTHER INFORMATION
The compensation range for this position is $145,000 - $165,000 annually.
This position is for an existing vacancy.
The hiring process for this position does not use Artificial Intelligence (AI).
