ABOUT THE TEAMThe Anduril Imaging team develops state-of-the-art imaging systems across both hardware and software, deployed to tackle the most significant security challenges of America and its allies. The team is heavily involved in utilizing computer vision, perception, electro-optical, infrared, and sensor data to give our war fighters and allies an advantage.
ABOUT THE JOBThe Space Imaging team is seeking an Electrical Engineer to join the team. The Space Imaging team is responsible for all aspects of spaceborne EO/IR system development, from the ideation stage through initial production. In this role, you will work closely with an interdisciplinary technical team to define the electrical architecture of space-qualified EO/IR sensor payloads - including power distribution, connector/harness interfaces, EMI/EMC protection, and high-speed communication interfaces - build and test prototypes, and mature designs into flight hardware products. As needed, you will also lead small teams of engineers from concept through system definition and development.
WHAT YOU'LL DO- Electrical Architecture: Define and own the electrical architecture for EO/IR sensor payload assemblies, including power distribution, connector/harness interfaces, grounding/bonding schemes, and communication interfaces.
- Power Electronics Design: Design, analyze, and test isolated power conversion, EMI filtering, inrush current limiting, and over-voltage/reverse-polarity protection circuitry for low-voltage DC payload power systems.
- Interface & Harness Design: Select connectors, define pin assignments, perform wire/cable and component derating analyses, and establish shielding, bonding, and isolation schemes to meet EMI/EMC requirements.
- Communication Interfaces: Design and support high-speed Ethernet (10GbE) and discrete I/O (RS-422, I2C, SPI) interfaces between sensor electronics and host avionics.
- EMC/ESD: Support EMI/EMC qualification testing (MIL-STD-461/464), and ESD protection design.
- Radiation Compliance: Radiation-tolerant (TID/SEU) component selection for space and tactical environments.
- Parts Stress & Reliability Analysis: Perform EEE parts stress/derating analyses and support hybrid microelectronics selection to ensure reliable operation across mission life.
- Hardware/Software Integration: Collaborate with firmware, mechanical, optical, and systems engineers to integrate electrical designs into sensor payload assemblies, including bring-up and verification testing.
- Testing and Validation: Develop and execute test procedures using lab equipment (oscilloscopes, power supplies, network analyzers, EMI test gear) to validate designs against functional and performance requirements.
REQUIRED QUALIFICATIONS- Education: A Bachelor's in Electrical Engineering or a related technical field is typically required.
- Experience: 8+ years of experience designing power, interface, or mixed-signal electronics for space, airborne, or other harsh-environment defense systems.
- Power Electronics & Circuit Design: Experience designing isolated DC/DC power conversion, EMI filters, and transient/over-voltage protection circuits for low-voltage DC systems.
- EMI/EMC Standards: Familiarity with MIL-STD-461 and MIL-STD-464 (or equivalent) EMI/EMC design and test methods.
- Interface/Harness Design: Experience with connector selection, pin/harness definition, and parts/wire derating analysis (e.g., per MIL-HDBK-1547A or equivalent).
- Debugging Skills: Strong hardware debugging skills using standard lab equipment (oscilloscopes, multimeters, logic/protocol analyzers).
- Analysis Tools: Proficiency with schematic capture/circuit simulation tools and worst-case stress/derating analysis.
- US Person status is required as this position needs to access export controlled data
- Eligible to obtain and maintain an active U.S. Secret security clearance
PREFERRED QUALIFICATIONS - Experience designing radiation-tolerant electronics and performing TID/SEU analysis for space systems
- Experience with high-speed digital/communication interfaces (10GbE, SERDES) and signal integrity analysis
- Familiarity with machine-vision/sensor communication protocols (e.g., GigE Vision)
- Experience with hybrid microelectronics packaging (MIL-PRF-38534) or similar high-reliability component standards
- PCB layout experience (e.g., Altium, Cadence) for mixed-signal or RF boards
- Familiarity with electro-optical/infrared sensor payload electronics (detector bias/readout, cryocooler drive electronics)
- Familiarity with embedded Linux/firmware interfaces to support electronics bring-up
US Salary Range
$146,000-$194,000 USD
The salary range for this role is an estimate based on a wide range of compensation factors, inclusive of base salary only. Actual salary offer may vary based on (but not limited to) work experience, education and/or training, critical skills, and/or business considerations. Highly competitive equity grants are included in the majority of full time offers; and are considered part of Anduril's total compensation package. Additionally, Anduril offers top-tier benefits for full-time employees, including:
BenefitsAt Anduril, we invest in our people. Our comprehensive, competitive benefits package (available at little to no cost to employees) ensures you're supported in health, recovery, and whatever comes next. For more information, Explore Our Benefits.
