Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a related field.
Experience with Teradyne UltraFLEX and/or J750 platforms for ATE test programs (required).
Strong programming skills in Python, C/C++, Perl, or other scripting languages for automation.
Experience in semiconductor production testing, silicon characterization, and high-volume manufacturing.
Knowledge of wafer sort (CP), final test (FT), yield analysis, and failure analysis.
Strong analytical, debugging, and problem-solving skills.
Ability to thrive in a fast-paced, cross-functional semiconductor startup environment.
Responsibilities
Develop, maintain, and optimize production ATE test programs using Teradyne UltraFLEX and/or J750 platforms.
Design and implement automation tools using Python, C/C++, or scripting languages to enhance test development efficiency.
Develop production test methodologies for analog, mixed-signal, memory, and AI semiconductor devices.
Perform silicon bring-up, characterization, correlation, and validation from engineering samples to high-volume manufacturing.
Analyze production yield, test data, and failure mechanisms to identify root causes and implement corrective actions.
Collaborate with cross-functional teams to support new product introduction (NPI) and manufacturing ramp.
Create automated data collection and reporting tools to monitor production quality and performance.
Benefits
Opportunities for professional growth and development in a cutting-edge semiconductor environment.
Collaborative work culture with cross-functional teams.
Exposure to advanced technologies like AI accelerators and embedded memory.
Potential for involvement in innovative projects and new product introductions.
Full Job Description
Responsibilities:
Develop, maintain, and optimize production ATE test programs using Teradyne UltraFLEX and/or J750 platforms for wafer sort (CP) and final test (FT).
Design and implement automation tools using Python, C/C++, or scripting languages to improve test development efficiency, data analysis, and manufacturing productivity.
Develop production test methodologies for analog, mixed-signal, memory, and AI semiconductor devices, ensuring high test coverage, yield, and quality.
Perform silicon bring-up, characterization, correlation, and validation from engineering samples through high-volume manufacturing.
Analyze production yield, test data, and failure mechanisms to identify root causes and implement corrective actions for yield and quality improvements.
Collaborate with IC Design, DFT, Product Engineering, Reliability, Device Engineering, and OSAT partners to support new product introduction (NPI) and manufacturing ramp.
Develop and optimize load boards, probe cards, test hardware, and test flows to improve throughput, reduce test time, and enhance production efficiency.
Create automated data collection, statistical analysis, reporting, and dashboard tools to monitor production quality and manufacturing performance.
Support manufacturing operations by troubleshooting ATE hardware, software, and production issues while driving continuous process improvements.
Document test methodologies, automation frameworks, production procedures, and engineering best practices to support scalable manufacturing.
Requirements:
Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a related technical field.
Experience developing production ATE test programs using Teradyne UltraFLEX and/or J750 platforms (required).
Strong programming skills in Python, C/C++, Perl, or other scripting languages for automation.
Experience with semiconductor production testing, silicon characterization, and high-volume manufacturing.
Knowledge of wafer sort (CP), final test (FT), yield analysis, statistical data analysis, and failure analysis.
Strong analytical, debugging, and problem-solving skills.
Ability to work effectively in a fast-paced, cross-functional semiconductor startup environment.
Preferred Qualifications:
Experience with RRAM, MRAM, embedded memory, AI accelerators, or Compute-in-Memory (CIM) technologies.
Experience with DFT methodologies, including Scan, MBIST, JTAG, or BIST.
Experience working with OSATs and semiconductor manufacturing operations.
Familiarity with JMP, MATLAB, SQL, or other data analysis tools.
Knowledge of reliability testing, HTOL, HTST, TDDB, ESD, or latch-up testing.
Experience with automated test hardware development, load board design, or probe card optimization.
Excellent communication skills and the ability to collaborate across engineering and manufacturing organizations.
