Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or related field.
4+ years of experience in product development, preferably in thermal management or connector technologies.
Minimum 3 years of experience with Liquid Cooling and CFD is required.
Strong proficiency in CAD tools (e.g., SolidWorks, Creo) and thermal simulation software (e.g., ANSYS, FloTHERM).
Proven experience in project management and cross-functional collaboration.
Excellent communication skills and customer-facing experience.
Responsibilities
Architect and develop liquid cooling plates for high-density front-end I/O connector applications.
Engineer microchannel structures and flow path configurations to enhance thermal efficiency.
Select and integrate materials for optimal thermal transfer and reliability in data centers.
Define and execute thermal performance testing, including heat dissipation and flow rate analysis.
Validate cooling plate designs against industry standards and customer requirements.
Lead cross-functional development projects from concept through production.
Serve as a technical liaison with customers to understand requirements and provide support.
Benefits
On-site work environment in Schaumburg, IL.
Opportunity to work on cutting-edge AI and ML technologies.
Engagement in cross-functional projects that enhance collaboration skills.
Access to advanced thermal management technologies.
Potential for professional growth in a rapidly evolving field.
Full Job Description
Job Title: Product Development / Thermal Engineer - Liquid Cooling
The position will be located on-site in Schaumburg, IL.
Position Overview
Amphenol is seeking a highly skilled and motivated Product Development Engineer to lead the design and development of liquid cooling solutions for front-end I/O connectors that will power the next generation of Artificial Intelligence (AI) and Machine Learning (ML) platforms. This role is critical to advancing thermal management technologies that support high-performance computing environments.
Key Responsibilities
Design & Development
Architect and develop liquid cooling plates optimized for high-density front-end I/O connector applications.
Engineer microchannel structures, cold plate geometries, and flow path configurations to maximize thermal efficiency and minimize pressure drop.
Select and integrate materials compatible with high-performance thermal transfer and long-term reliability in data center environments.
Collaborate with connector design teams to ensure seamless mechanical integration and manufacturability.
Testing & Validation
Define and execute thermal performance testing, including heat dissipation, flow rate analysis, and environmental stress testing.
Validate cooling plate designs against industry standards and customer-specific requirements.
Work with internal labs and external partners to ensure robust qualification and certification processes.
Project Management
Lead cross-functional development projects from concept through production.
Manage timelines, deliverables, and resource coordination to meet program milestones.
Track and report progress using structured project management tools and methodologies.
Customer Engagement
Serve as a technical liaison with key customers to understand requirements and deliver exceptional support.
Represent Amphenol's commitment to exceptional customer experience through proactive communication, technical presentations, and issue resolution.
Qualifications
Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or related field.
4+ years of work experience in product development, preferably in thermal management or connector technologies.
Minimum 3 years of work experience with Liquid Cooling and CFD is required (MUST HAVE)
Strong proficiency in CAD tools (e.g., SolidWorks, Creo) and thermal simulation software (e.g., ANSYS, FloTHERM).
Proven experience in project management and cross-functional collaboration.
Excellent communication skills and customer-facing experience.
Preferred Skills
Familiarity with high-speed I/O connector standards and applications.
Experience in AI/ML hardware environments or data center infrastructure.
Knowledge of fluid dynamics, heat exchanger design, and materials used in liquid cooling systems.
