Core Process Development & Optimization- Set up assembly parameters: Program and fine-tune SMT line equipment, including screen printers, Solder Paste Inspection (SPI), Pick and Place machines, multi-zone Reflow-Vacuum Ovens and the following processes:
- Selective/Wave Soldering
- De-panel Router
- Automatic Press fit
- Inline Chemical and DI Washer
- Develop thermal profiles: Create and validate reflow soldering profiles tailored to specific printed circuit board (PCB) layouts, component densities, and solder paste types.
Quality Control & Troubleshooting- Drive root-cause analysis: Investigate SMT defects (e.g., misalignments, bridging, voids) using Automated Optical Inspection (AOI), X-ray inspection, and microscopic failure analysis
- Monitor with SPC: Use Statistical Process Control (SPC) and process capability studies (Cp/Cpk) to track line variability and catch deviations early.
- Ensure compliance: Maintain adherence to strict industry standards like IPC-A-610 and J-STD-001.
Continuous Improvement & Line Efficiency- Improve OEE (Overall Equipment Effectiveness): Track cycle times, line balancing, and machine downtime to maximize factory output.
- Apply Lean/Six Sigma: Implement 5S, DMAIC, or Kaizen events to reduce waste and lower production costs.
- Create documentation: Write and update Standard Operating Procedures (SOPs), PFMEAs, and machine control plans
