Job Title: Process Engineer
Location: Tempe, AZ
Division: Technology
Department: Manufacturing
Position DescriptionWe are seeking a highly motivated Process Engineer to join our Thin-Film Lithium Niobate (TFLN) photonics foundry team. This role focuses on semiconductor nanofabrication, process development, and the continuous improvement of manufacturing processes for advanced TFLN photonic integrated devices. This is a hands-on cleanroom engineering position, and the successful candidate will spend a significant portion of their time operating fabrication equipment, troubleshooting processes, and conducting experiments in the cleanroom. The candidate will be accountable for developing and maintaining robust processes that support QCi's manufacturing objectives for safety, quality, cost, and delivery.
Duties and Responsibilities- Perform hands-on semiconductor and photonic device fabrication in a cleanroom environment using a range of nanofabrication tools, including e-beam and photolithography systems, plasma etchers, chemical and physical vapor deposition systems, e-beam evaporators, and metal electroplating equipment.
- Design, lead, and execute R&D experiments to improve nanofabrication results, process stability, repeatability, yield, and overall process capability.
- Facilitate the transition of research-scale, chip-level processes to low- and medium-volume wafer-scale manufacturing.
- Use advanced metrology tools, including critical-dimension scanning electron microscopy (CD-SEM), atomic force microscopy (AFM), ellipsometry, profilometry, X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and optical interferometry, for process characterization and defect analysis.
- Troubleshoot process deviations, particle contamination, and equipment or unit-process performance issues; implement corrective actions and continuous-improvement strategies.
- Establish and maintain statistical process control (SPC) systems for process monitoring and optimization.
- Collaborate with process integration, equipment, and design engineers, as well as other foundry team members, to resolve fabrication challenges.
- Support rapid experimental iteration and maintain short turnaround times between fabrication, characterization, data analysis, and subsequent process runs.
- Develop and maintain standard operating procedures (SOPs), process specifications, work instructions, and best-known-method documentation.
- Mentor junior engineers and provide technical leadership in semiconductor lithography, wet processing, mask processes, and related metrology.
- Bachelor's, Master's, or Ph.D. degree in Materials Science, Electrical Engineering, Physics, or a related field.
- 5+ years of hands-on semiconductor process engineering experience, with expertise in at least one of the following areas: e-beam lithography, photolithography, plasma dry etching, wet etching and cleaning, chemical vapor deposition, physical vapor deposition, e-beam evaporation, or metal electroplating.
- Hands-on experience with metrology tools such as CD-SEM, AFM, ellipsometry, film-thickness measurement systems, and particle-measurement systems for process verification and defect analysis.
- Demonstrated ability to design and execute technical experiments, analyze results, and draw meaningful conclusions from experimental data.
- Strong problem-solving skills and experience with data analysis, SPC, and design of experiments (DOE).
- Ability to work in a cleanroom environment and collaborate effectively with cross-functional engineering teams.
- Experience defining and implementing inspection methods, calibration systems, and SOPs
Required Skills and Experience- Bachelor's, Master's, or Ph.D. degree in Materials Science, Electrical Engineering, Physics, or a related field.
- 5+ years of hands-on semiconductor process engineering experience, with expertise in at least one of the following areas: e-beam lithography, photolithography, plasma dry etching, wet etching and cleaning, chemical vapor deposition, physical vapor deposition, e-beam evaporation, or metal electroplating.
- Hands-on experience with metrology tools such as CD-SEM, AFM, ellipsometry, film-thickness measurement systems, and particle-measurement systems for process verification and defect analysis.
- Demonstrated ability to design and execute technical experiments, analyze results, and draw meaningful conclusions from experimental data.
- Strong problem-solving skills and experience with data analysis, SPC, and design of experiments (DOE).
- Ability to work in a cleanroom environment and collaborate effectively with cross-functional engineering teams.
- Experience defining and implementing inspection methods, calibration systems, and SOPs
Preferred Qualifications- 5+ years of industry experience in compound semiconductor fabrication or photonic integrated circuit processing.
- Experience with nanofabrication of photonic devices, process integration, photonic material properties and modification, and the integration of MEMS and electronic devices. Specific knowledge of lithography, etching, deposition, sputtering, and related processes is highly valued.
- Experience applying large-scale data analytics to track-and-trace datasets to enable predictive insights and real-time defect containment.
- Experience with heterogeneous wafer-to-wafer or chip-to-wafer bonding is valued.
- Experience with 5S and Six Sigma methodologies.
Incumbent(s) in this position may be required to perform other duties and special assignments not specifically stated above. Statements outlined in this section are designated as essential job functions in accordance with the Americans with Disabilities Act of 1990.
