PURPOSE: - To support new customer ramp up plan for SIPHOG production 2027 in clean room advance packaging assemblies (D/A W/B)
PRINCIPLE ACCOUNTABILITIES / DUTIES:- Develop and optimize die attach and wire bond processes for prototype, NPI, and production assemblies in the advanced packaging cleanroom.
- Create and qualify machine/process recipes for die bonder, wire bonder, plasma cleaner, epoxy dispenser, and active optical alignment equipment.
- Create, improve and document optical splicing and routing for fiber optics box build assembly.
- Lead root cause analysis and corrective actions for process excursions.
- Establish inspection criteria, acceptance procedures, and metrology methods for optical and photonic sub-assemblies.
- Design and order necessary tooling and ensure availability of all consumables
PREVIOUS EXPERIENCE REQUIRED: (include experience required with specific software applications, equipment, or specific certifications and education requirements such as MSME, MSEE, APICS, etc)
PREFERRED Qualifications (nice to have skills): 0-1 year experience in cleanroom manufacturing environment
Understand principle for die bonding in microelectronics
Basic Programming python, Excel for data analysis Education or Training: • BS degree required in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, Optical Engineering, or Physics.
