Principal Structural & Mechanical Analysis Engineer - Remote within the U.S.

Job Title: Principal Structural & Mechanical Analysis Engineer - Remote within the U.S. Posting Start Date: 10/9/26 Job Description: Job Overview The Digital Data Networks (DDN) Business Unit is seeking a highly skilled and driven PRINCIPAL R&D/PRODUCT DVL ENGINEER within the Advanced Development (AD) team. In this key technical role, you will be responsible for spearheading structural mechanics, thermal-mechanical coupling, and multi-physics modeling to rapidly screen, evaluate, and down-select next-generation high-speed interconnect technology concepts. You will tackle critical engineering challenges across switches, servers, data storage systems, and AI hardware platforms-pushing the boundaries of density, signal integrity, and mechanical reliability. As a senior technical contributor in the DDN Advanced Development team, you will establish first-principles analytical models and high-fidelity simulations to generate decision-quality performance predictions. You will lead simulation-driven design trade-offs, drive model-to-test correlation, and partner closely with cross-functional teams including Signal Integrity, Mechanical Design, Product Management, and Front-Line Product Engineering (PDE/NPI). Additionally, you will play an instrumental role in shaping the team's Advanced Simulation roadmap and maturing virtual prototyping methodologies. Key qualifications include a proven track record of superior technical expertise in finite element analysis (FEA), advanced mechanical and thermal-mechanical modeling, and a passion for engineering innovation. You are expected to drive prediction-driven decision-making through rigorous model verification and validation (V&V), clearly communicate engineering trade-offs, and mentor engineering peers in best simulation practices. Job Requirements 3 Lead the development, application, and continuous improvement of first-principles engineering analysis, FEA modeling, and multi-physics simulation to down-select solution concepts. 3 Build first principles and reduced-order mechanical/thermal models to quickly screen early architectures and identify scaling limits. 3 Execute advanced high-fidelity non-linear structural and thermal-mechanical simulations (e.g., elastoplastic deformation, creep, stress relaxation, thermal expansion/CTE mismatch, contact mechanics, and insertion/retention force). 3 Perform sensitivity studies, tolerance stack-ups, and statistical variation analyses to understand assembly robustness, coplanarity, and risk early in the product lifecycle. 3 Partner with design engineers to define simulation-ready geometry, boundary conditions, and loading scenarios supported by GD&T interpretation. 3 Handle complex FEA models involving hundreds of components in high-speed interconnect systems to build high-fidelity simulation models. Simplify models as appropriate to balance simulation accuracy, computational efficiency, and delivery timelines. 3 Deliver comprehensive simulation reports, actionable design recommendations, and technical presentations to drive executive and architectural down-selection. 3 Define and lead physical prototype test plans; actively partner with test labs to execute model verification and validation (V&V), correlate experimental data with simulation results, and calibrate constitutive material models. 3 Collaborate with PDE/NPI teams to ensure smooth handoff of validated simulation models, design guidelines, and predictive methodologies for commercialization. 3 Champion simulation process automation, script development, and methodology standardization across the engineering group. 3 Maintain deep awareness of cutting-edge simulation tools, high-performance computing (HPC/Cloud), advanced material systems, and emerging packaging/interconnect technologies. What your background should look like 3 Bachelor's degree in Mechanical Engineering, Aerospace Engineering, Materials Science, or related field; Master's Degree or Ph.D. strongly preferred. 3 Generally requires 8-10+ years of progressive engineering experience in high-fidelity FEA and structural/thermal-mechanical analysis in high-tech electromechanical products, connectors, high-speed interconnects, or electronic packaging. 3 Recognized technical expert in commercial FEA platforms (e.g., Ansys Mechanical, preferred) with demonstrated mastery in non-linear materials, complex contact interfaces, dynamic response, and thermal-stress coupling. 3 Strong practical experience in test correlation and model calibration (e.g., strain gauge testing, displacement/force measurement, thermal warpage profiling). 3 Deep understanding of high-speed interconnect architecture, micro-contact physics, spring pin design, socket/cable assemblies, and CTE management in AI/compute hardware environments. 3 Working knowledge of 3D CAD platforms (Creo and SpaceClaim preferred) for geometric defeaturing, parameterization, and simulation prep. 3 Experience with cloud/HPC simulation environments (e.g., Rescale) and automation scripting (Python, MATLAB) is a plus. 3 Proven ability to work effectively in a cross-functional, global R&D environment, translating complex technical findings into actionable engineering guidance. 3 Excellent written and verbal communication skills. Competencies 3 Values: Integrity, Accountability, Teamwork, Innovation 3 Technical Leadership & Influence (Individual Contributor track) 3 Problem Solving & Analytical Rigor COMPENSATION 3 Competitive base salary commensurate with experience: $158,200 - 197,800 (subject to change dependent on physical location) 3 Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity. 3 Total Compensation = Base Salary + Incentive(s) + Benefits BENEFITS 3 A comprehensive benefits package including health insurance, 401(k), disability, life insurance, employee stock purchase plan, paid time off and voluntary benefits. Job Locations: United States Posting City: # Job Country: United States Travel Required: Less than 10% Requisition ID: 160180 Workplace Type: Remote External Careers Page: Engineering & Technology