BS in Electrical, Mechanical, Process Engineering, or Material Science.
12+ years of experience in semiconductor packaging technology (or MS with 8 years).
Strong project management and communication skills, including writing and presentation.
Expertise in overmolded laminate module packaging processes: SMT, Wirebonding, Die Attach, Molding.
Knowledge of assembly processes such as Flip Chip Bumping, Fan Out, WLCSP, BGA.
Experience with Advanced RF SiP Modules and working with OSAT Assembly Factories in Asia.
Responsibilities
Collaborate with IC design teams to establish package requirements.
Own specific products from feasibility through to mass production.
Implement DFM/BKM practices to enhance yield, cost, and reliability.
Develop new assembly technologies and conduct process design experiments (DOEs).
Identify new materials and equipment, perform reliability testing and process qualification.
Benefits
Healthcare benefits including a premium-free medical plan option.
401(k) plan with company match.
Employee stock purchase plan.
Paid time off including vacation, sick leave, and parental leave.
Participation in an incentive plan and eligibility for additional performance-based awards.
Full Job Description
Principal Packaging Engineer
Posting Start Date: 3/23/26
Job Location(s): San Jose
Requisition ID: 77070
Job Description:
Description
We are seeking a Principal Packaging Engineer with expertice in advanced laminate packaging technologies to support new product development (NPI) of RF System in Package (SiP) modules. Candidate will be the RF packaging interface between multi-functional groups within Skyworks and internal/external manufacturing.
This position offers significant opportunities for growth, including leading strategic packaging initiatives and influencing Skyworks packaging technology roadmap. Leadership experience, either as a program manager, people manager, or technical lead is a strong plus.
On-site location is flexiable. Desired location in San Jose CA or Irvine CA.
Responsibilities
Working with IC design teams to define and implement the package requirements.
Ownership of specific product from feasibility stage to high volume production.
Ensuring that DFM/BKM is implemented for assembly yield, cost, and reliability.
Developing new assembly technologies, running process DOE's, identifying new materials and equipment, reliability testing, and qualification of new assembly process.
Required Experience and Skills
BS Degree in either Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science.
Minimum 12 years experience (or MS and 8 years) in semiconductor packaging technology
Strong project management and communication skills (verbal, written, and presentation).
Expertise with overmolded laminate module packaging processes: SMT, Wirebonding, Die Attach, and Molding.
Knowledge of various assembly processes: Flip Chip Bumping, Fan Out, WLCSP, BGA, Module Level Shielding, and IPDs.
Experience in Advanced RF SiP Moldules: Dual Side BGA, Dual Side Mold Grid Array, EMI Shielding,
Experience working with OSAT Assembly Factories in Asia.
Desired Experience and Skills
Solid understanding of Design Rules Check and Design for Manufacturing
Hands on experience with assembly process/equipment.
Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
Understanding of RF products and concepts is highly desired.
Experience with Failure Analysis.
Understanding of Module and Board Level Reliability requirements.
Understanding of manufacturing of organic laminate technologies.
Experience with Lead-Frame Packaging.
Prior R&D experience of advanced packaging concepts.
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The typical base pay range for this role across the U.S. is currently USD $129,400 - $247,800 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.
About Skyworks Solutions
Skyworks Solutions is a semiconductor company that designs and manufactures radio frequency (RF) and microwave components and integrated circuits (ICs) for the wireless communications industry. The company's products are used in a wide range of applications, including smartphones, tablets, and other mobile devices, as well as in wireless infrastructure equipment. Skyworks Solutions was founded in 2002 and is headquartered in Irvine, California. The company has operations in North America, Europe, and Asia.
