Master's degree or higher in Packaging, Materials Science, Mechanical Engineering, Optical Engineering, or related field.
8+ years of experience in semiconductor packaging, focused on photonic or advanced packaging.
Hands-on experience with fiber attach processes and optical coupling techniques.
Familiarity with various packaging technologies, including flip-chip and micro-optics integration.
Understanding of reliability standards and qualification methodologies for optical modules.
Excellent analytical, problem-solving, and communication skills.
Experience in transitioning packaged products from development to production.
Responsibilities
Define and design optical packaging architectures for SiPh modules, including fiber attach and photonic die placement.
Develop scalable fiber-to-chip coupling strategies for high-density optical I/O.
Drive heterogeneous integration of photonic and electronic components using advanced packaging technologies.
Perform multiphysics simulations to optimize package performance and reliability.
Lead root cause analysis for yield and reliability issues.
Collaborate with OSATs and manufacturing teams for mass production readiness.
Support cost modeling and drive package cost reduction initiatives.
Benefits
Opportunity for collaboration with various engineering disciplines.
Advanced career development in the field of optical packaging engineering.
Involvement in innovative projects using cutting-edge technologies.
Exposure to a dynamic working environment with significant industry impact.
Flexibility with up to 25% travel to partner sites and global facilities.
Full Job Description
Summary of Role
As a Packaging Engineer within GF's Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets.
Essential Responsibilities include:
Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.
Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).
Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.
Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.
Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.
Support cost modeling and drive package cost reduction initiatives aligned with GF's B2B supply chain strategy.
Present technical updates and roadmaps to internal stakeholders and external partners.
Other Responsibilities
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Travel up to 25% to other GlobalFoundries facilities or external partner sites may be necessary.
Required Qualifications
Master's degree or higher in Packaging, Materials Science, Mechanical Engineering, Optical Engineering or related field.
8+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.
Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.
Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.
Understanding of reliability standards and qualification methodologies for optical modules.
Excellent analytical, problem-solving, and communication skills.
Experience in bringing packaged products from development into production.
Strong written and spoken English communication skills.
Preferred Qualifications
Experience with automated optical/electro-optical test setups and motion control systems (e.g., Python-based).
Knowledge of co-packaged optics (CPO), pluggable modules, and silicon photonics ecosystems.
Expertise in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.
Strong background in thermal/mechanical modeling and optical simulation tools (e.g., Lumerical, COMSOL).
Familiarity with GF's Fotonix™ platform, including 300mm monolithic SiPh integration and advanced packaging flows.
Experience working with OSATs and managing external development partners.
Demonstrated ability to lead cross-functional teams and influence technical direction.
Expected Salary Range $143,000.00 - $247,000.00
The exact Salary will be determined based on qualifications, experience and location.
