Cornelis Networks is hiring a talented Mechanical Engineer with experience in system and printed circuit board (PCB) assembly mechanical design. The mechanical engineer will be involved in all phases of mechanical architecture and hardware development for high-performance electronics, focusing primarily on the next-generation Cornelis Networks Fabric platforms (adapters and switches).
Key tasks include:
- Mechanical Design & Architecture: Lead the mechanical design of high-performance interconnect products including PCIe adapters, networking switches, and complex electronic assemblies.
- NPI & Mass Production: Drive products through the complete NPI lifecycle, from early architecture and EVT/DVT validation to tooling release and high-volume mass production (MP).
- Manufacturing & DFM: Apply deep expertise in manufacturing processes-specifically die casting, sheet metal fabrication, and extrusion-to ensure designs are optimized for mass production, cost, and reliability.
- CAD & PLM Ownership: Create, maintain, and manage 3D models, 2D drawings, and BOMs using PTC Creo and Windchill (or similar enterprise CAD/PLM tools).
- Cross-Functional Collaboration: Partner closely with thermal, electrical, regulatory, and manufacturing teams to manage trade-offs involving mechanical envelopes, structural integrity, and thermal constraints.
- Prototyping & Lab Testing: Drive physical prototyping, tolerance stack-up analysis, and mechanical qualification testing (e.g., shock, vibration, environmental) in the lab.
Minimum qualifications
- BS in Mechanical Engineering or a closely related field.
- 5+ years of experience in the mechanical design of electronics packaging, adapters, or networking hardware.
- Strong expertise in standard datacenter form factors (PCIe, OCP 3.0, EIA-310) and rack-level mechanical integration.
- Deep understanding of volume manufacturing processes including die casting, sheet metal, and extrusion.
- Proven track record of managing global CMs/ODMs, driving tooling kickoffs, and resolving factory escalations during volume ramp-up.
- Proficiency with MCAD and PLM tools (PTC Creo and Windchill strongly preferred; SolidWorks, NX, or similar acceptable).
- Experience driving Root Cause Analysis (RCA) and tolerance stack-up analysis for mechanical assemblies and failures.
- Excellent communication and interpersonal skills; accustomed to cross-disciplinary teamwork.
Preferred qualifications:
- Experience with high-performance computing (HPC) or data center hardware environments.
- Familiarity with advanced high-performance cooling solutions, including large-scale heat sinks, TIMs, and Direct Liquid Cooling (DLC) architectures.
Location:
This position is hybrid (on-site with some remote work possible) at the headquarters in the Chesterbrook Corporate Center in Wayne, PA. The successful candidate resides within commuting distance.
