Manufacturing Engineer 2nd Shift

Overview

Job Title: Manufacturing Engineer 2nd Shift

Job Location: Torrance, CA

Salary: $80,000-$130,000/yr Depending on experience and level

 

Stellant is excited to offer aManufacturing Engineering rolein support of Electronic Power Conditioner (EPC) assembly and test at our Torrance facility. Specifically, this role will focus on Printed Circuit Board Assembly (PCBA), Surface Mount Technology (SMT) applications and the intricacies that go into building a PCBAs and completed high voltage EPC for Space applications. Stellants industry leading EPCs have supported space borne communications for greater than 3 decades, with over 4700 units in orbit and 290 million operating hours. The role may also support terrestrial applications (RF communications, electronic warfare and radar) in our Microwave Power Modules (MPMs). Combing our Space heritage and terrestrial usage, Stellants EPC / MPM design, development and manufacturing areas provide a rewarding workplace for talented engineers to lay their mark. Outside of PCBA specific items, responsibilities will also include providing technical guidance on the manufacturing floor, supporting investigations with a multidisciplinary group of engineers, communicating with vendors in support of production or development and providing customer support as needed. Beyond EPC specific work, the role will may also support integration and testing of completed traveling wave tube amplifiers (TWTAs) and MPMs.

Responsibilities

• Manufacturing Engineer will work with suppliers and inside production organizations to develop, manage, and improve the PCBA manufacturing process.
• PCBA/SMT Manufacturing engineer works with suppliers and internal teams to validate new equipment and processes and continuously seeks to improve the production process.
• Support PCBA manufacturing processes and PCBA products.
• Help production team with learning and understanding die-bonding, and wire bonding assembly processes, skills, tools, and equipment.
• Collaborate with other functional groups to develop wire bond solutions to meet business needs.
• Provide training in die-assembly, wire bond technology, problem analysis and resolution.
• Knowledge and understanding of the following preferred:
  • Mechanical assembly of channel amplifiers, linearizers, or other precision microwave parts and provide MIC assembly technical support.
  • Mechanical assembly consisting of housing fabrication for HI-REL RF applications.
  • MIC assembly consisting of brazing, die attach, wedge-wedge bonding and gap welding.
  • Support test for electrical changes being performed for tuning purposes.
• Ability to work under a microscope for extended periods of time
• Ability to have eye to hand dexterity and fine motor skills
• Estimate manufacturing costs and determine time standards for tooling and process requirements of new or existing product lines.
• Manage work instructions, process documentation, and training withing organization and suppliers.
• Identify trends and opportunities for optimizing product output, quality enhancements, and cost of manufacturability.
• Provide feedback to Engineering Design team to improve design for manufacturability.
• Identify, root-cause, and correct SMT production and testing issues.
• Drive corrective actions and process improvements on owned processes and products.

Qualifications

This role requires relevant engineering experience that includes a combination of or equivalent experience in manufacturing engineering of PCBAs, microelectronics, or similar manufacturing processes.

• Level II: requires a minimum of 2 years of relevant experience and a bachelors degree in mechanical, manufacturing, or electrical engineering discipline.
• Level III: requires a minimum of 4 years of relevant experience and a bachelors degree in mechanical, manufacturing, or electrical engineering discipline.
• Level IV: requires a minimum of 6 years of relevant experience and a bachelors degree in mechanical, manufacturing, or electrical engineering discipline.

Role also requires:

• Strong verbal and written technical communication skills.
• Ability to interpret schematics, engineering drawings, and product specifications.
• Basic knowledge of GD&T.
• Strong analytical, fault isolation and problem-solving skills.
• Strong organization skills and attention to details.
• Experience in process design, development and project planning in related fields.
• Experience in preparing and maintaining assembly instructions, drawings, procedures, process routers and Bills of Materials with strong understanding of configuration management.
• Being able to develop and execute Statistical Process Control for Manufacturing.
• Experience in secondary operations including manual (hand) soldering, point to point wiring, and solder rework station processes.
• Understanding of Material behavior such as Thermal fatigue and solder creep preferred.
• Understanding of multilayer and Rigid-Flex PCB manufacturing processes preferred.
• Knowledge of solder joint reliability and fatigue contributing characteristics preferred.
• Ability to work in a fast-moving environment under tight schedules and coordinate multiple tasks effectively.