10+ years of mechanical design experience in electronic hardware, including 3+ years in a management role.
Proven track record in bringing networking, telecom, or server systems from concept to production.
Strong expertise in thermal management for high-power electronics and experience with CFD tools.
Proficient in 3D CAD software (Creo, SolidWorks, or NX) and PLM workflows.
In-depth knowledge of DFM/DFA, GD&T, and manufacturing processes.
Experience collaborating with contract manufacturers and suppliers, including overseas.
Excellent communication skills with engineers and cross-functional teams.
Bachelor's degree in Mechanical Engineering or a related field.
Responsibilities
Lead and develop a team of mechanical and thermal engineers with regular feedback and goal-setting.
Oversee mechanical design from concept to mass production, including chassis and enclosures.
Drive thermal architecture for high-power systems, utilizing air and liquid cooling solutions.
Establish design standards and review processes for the engineering team.
Collaborate with cross-functional teams on board layout and component placement.
Manage relationships with contract manufacturers and suppliers throughout the production process.
Maintain mechanical schedules and risk tracking across multiple projects.
Ensure compliance with industry standards for reliability and safety.
Benefits
Opportunity to shape the future of AI infrastructure.
Work with a world-class team on innovative technology.
Direct impact on the next generation of AI infrastructure solutions.
Full Job Description
Position Overview
We're hiring a Mechanical Engineering Manager to lead the team that designs the enclosures, chassis, and thermal solutions for our switching and interconnect hardware. You'll report to the Director of Thermal and Mechanical Engineering and lead a team of mechanical and thermal engineers. This is a player-coach role. You'll set technical direction, grow the team, and stay hands-on enough to make the hard design calls on high-power, high-density systems.
Responsibilities
Lead, hire, and develop a team of mechanical and thermal engineers, with regular 1:1s, clear goals, and honest feedback.
Own mechanical design from concept through mass production: chassis, enclosures, line cards, front panels, heatsinks, and cable and fiber management.
Drive thermal architecture for high-power ASICs and optics, including air cooling and liquid-cooling options such as cold plates.
Set design standards, review processes (DFM, DFA, tolerance analysis), and documentation practices for the team.
Partner closely with silicon, hardware, optics, signal integrity, and systems teams on board layout, component placement, and power budgets.
Manage contract manufacturers and suppliers for sheet metal, die-cast, machined, and plastic parts through prototype, NPI, and volume ramp.
Own mechanical schedules, resource plans, and risk tracking across multiple concurrent programs.
Lead compliance and reliability work: NEBS, shock and vibration, safety (UL/IEC), EMC enclosure design, and OCP or OEM rack requirements where applicable.
Minimum Qualifications
10+ years of mechanical design experience on electronic hardware, including 3+ years managing engineers.
A track record of taking networking, telecom, server, or similar rack-mounted systems from concept to volume production.
Strong grounding in thermal management for high-power electronics, plus hands-on use of CFD tools (e.g., FloTHERM, Icepak, or 6SigmaET).
Fluency in 3D CAD (Creo, SolidWorks, or NX) and PLM workflows.
Deep knowledge of DFM/DFA, GD&T, tolerance analysis, and common manufacturing processes.
Experience working directly with contract manufacturers and suppliers, including overseas.
Clear communication with engineers, cross-functional partners, and leadership.
Occasional travel to contract manufacturers and suppliers
Bachelor's Science in Mechanical Engineering or a related field or experience
Preferred Qualifications
MS in Mechanical Engineering, with a focus on heat transfer or fluid mechanics.
Liquid-cooling experience: cold plates, manifolds, quick disconnects, or immersion.
Background in optical networking or pluggable optics (QSFP-DD, OSFP) and their thermal challenges.
Familiarity with OCP specifications and hyperscale data center deployment requirements.
Experience building a team or function at an early-stage startup.
Exposure to FEA for structural, shock, and vibration analysis.
Why Join Us?
At Eridu, you'll have the opportunity to shape the future of AI infrastructure, working with a world-class team on groundbreaking technology that pushes the boundaries of AI performance. Your contributions will directly impact the next generation of AI infrastructure solutions, transforming the performance of AI data centers.
The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.
