Job Description
Teledyne Digital Imaging is a subsidiary of Teledyne Technologies Inc., a U.S. publicly listed enterprise, and specializes in the manufacture, design, research and development of high-performance CMOS and CCD image sensors and modular expandable cameras. Teledyne Digital Imaging's products are used worldwide in high-speed machine vision, document scanning, image capture, surveillance, process monitoring, manufacturing inspection, medical imaging, and multimedia.
Teledyne Digital Imaging is looking for a Hardware Technical Leader to help shape the electronics behind next-generation machine vision camera platforms. This is an opportunity to work at the intersection of advanced electronics, high-speed imaging, and real-world product performance.
If you enjoy solving difficult technical problems, setting architectural direction, and helping engineering teams turn ambitious ideas into robust products, this role offers the chance to make an impact across multiple platforms and programs.
What you’ll do
- Set technical direction for electronics architectures across machine vision camera platforms.
- Architect board-level solutions that improve performance, scalability, reliability, and product longevity.
- Lead resolution of complex analog, digital, mixed-signal, power, and high-speed design challenges.
- Establish design methodologies and engineering standards across teams.
- Guide critical trade-offs involving performance, cost, manufacturability, and business needs.
- Serve as a technical authority for design, production, and customer-impacting challenges.
- Influence product roadmaps and future technology choices.
- Mentor engineers and strengthen technical capability across multidisciplinary teams.
What you need
- Required: Expert-level analog, digital, mixed-signal, power, and high-speed electronics design skills.
- Required: Deep knowledge of PCB architecture, signal integrity, power integrity, and system integration.
- Required: Experience with ADCs/DACs, SMPS/LDOs, op-amps, FPGAs, microcontrollers, fiber optics, and high-speed interfaces.
- Required: Demonstrated ability to lead, influence, and mentor multidisciplinary engineering teams.
- Required: Proven experience driving complex projects, architectural decisions, and technical innovation.
- Required: Strong technical communication, proposal development, and stakeholder presentation skills.
- Required: Bachelor’s degree in electrical engineering or related discipline and typically 12+ years of relevant experience.
- Advantage: Master’s or PhD in Electrical Engineering.
What we offer
- Work on sophisticated imaging technologies with real-world applications.
- Deep technical challenges spanning electronics, imaging, and system integration.
- Opportunities to collaborate across engineering disciplines and business functions.
- An environment where technical leadership and innovation have meaningful product impact.
- Opportunities to mentor others while continuing to grow your own technical depth.
What happens next
After you apply, the recruiting team will review your experience against the role. Selected candidates may progress through a recruiter screen followed by interviews with the hiring and engineering teams. Timelines may vary.
Teledyne is committed to attracting talented people who want to solve challenging technical problems and contribute to impactful technologies.
Salary Range:
$93,700.00-$124,900.000
The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.
