Tenstorrent is building high-performance AI systems and the supply chain required to deliver them at scale. We are looking for a Global Supply Chain Manager to own OSAT partnerships, backend manufacturing execution, and supply continuity from wafer-out through final shipment.
This role is based in Toronto, Taiwan, or Austin, with regular travel to Taiwan and other Asia-based partner sites, approximately 25-30%. Candidates should be located near one of these hubs and able to work effectively across North American and Asia-Pacific time zones.
We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.
Who You Are- Bring 7+ years of experience in semiconductor supply chain, manufacturing, or supplier management, along with a bachelor's degree in Supply Chain, Engineering, or a related discipline.
- Have a strong understanding of OSAT workflows, including flip-chip, wire bond, and wafer-level packaging, with hands-on experience working with Taiwan-based OSAT partners.
- Are comfortable negotiating complex supplier agreements, pricing, tooling, or NRE costs and managing relationships across technical, commercial, and operational issues.
- Are a clear, direct, and trusted communicator who can work effectively across global teams, suppliers, and North American and Asia-Pacific time zones; Mandarin fluency is a plus.
- Are a structured, data-driven operator with experience using ERP systems such as SAP or Oracle, PLM systems, and reporting tools such as Tableau or Power BI, and you take ownership in ambiguous situations.
What We Need- Lead OSAT supplier relationships, QBRs, KPI reviews, escalations, and commercial negotiations while building trust and holding partners accountable.
- Coordinate engineering builds, qualification lots, process readiness, yield ramps, demand, capacity, materials, and production schedules across OSAT partners.
- Manage backend operations including bumping, assembly, burn-in, final test, and system-level test for advanced packaging and multi-die products.
- Own substrate and critical-material sourcing, including capacity, pricing, tooling, lead-time risk, and high-density substrate requirements for HBM and AI compute products.
- Resolve supply, quality, yield, logistics, and schedule risks while establishing reliable OSAT data, KPIs, and processes to support analytics and automation.
What You Will Learn- How advanced AI hardware moves from wafer fabrication through packaged silicon delivery.
- How OSAT capacity, yield, quality, cost, and logistics decisions affect product availability.
- How to manage strategic partnerships with leading semiconductor manufacturers across Asia.
- How advanced packaging and multi-die products scale from qualification into volume production.
Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.
Tenstorrent offers a highly competitive compensation package and benefits.
