The RoleWe are seeking an experienced
Principal / Manager for Foundry Partnership & ASIC Program Management to lead our strategic foundry engagements and end-to-end execution for our upcoming advanced-node ASIC projects. As the first dedicated liaison between our engineering team and our foundry partners (specifically Samsung Foundry), you will own the commercial, technical, and operational lifecycle-from contract execution and PDK/IP alignment to milestone tracking, quality assurance, and tapeout delivery for Q4 2027
Key Responsibilities1. Foundry Partnership & Tape-out Management- Vendor & Commercial Strategy: Drive strategic relationships, NDAs, MSAs, and Foundry Access Agreements with a global leading Foundry and its ecosystem partners (IP vendors, EDA tool providers, and OSATs).
- Business & Technical Interface: Act as the primary single point of contact for the Foundry's Customer Engineering (CE) and business development teams. Lead regular business/technical reviews.
- Capacity & Shuttle Planning: Evaluate MPW runs vs. dedicated full-mask schedules to optimize cost, lead times, and risk profile.
2. ASIC Technical Program Management (TPM)- Tapeout Lifecycle Ownership: Build, manage, and drive the detailed multi-phase schedule from RTL freeze, synthesis, and P&R to final DRC/LVS sign-off and GDSII submission.
- Cross-Functional Coordination: Align internal design teams (RTL, Architecture, DV, Physical Design) with external foundry support teams to address technical blockers proactively.
- Risk Management: Establish contingency strategies for schedule deviations, design modifications, or IP integration delays to ensure the 2027 tapeout deadline is met.
3. Quality Assurance (QA) & Reliability- Qualification Roadmaps: Establish silicon validation, ESD, and Latch-up testing criteria in alignment with foundry guidelines.
- Silicon Production Monitoring: Oversee process monitor data, Wafer Acceptance Testing (WAT), yield metrics, and defect density tracking during silicon fabrication.
- Packaging & Bring-up Coordination: Partner with OSAT vendors to manage package substrate development, assembly, and post-silicon bring-up readiness.
Qualifications & Requirements- Experience: 8+ years in the semiconductor industry, with at least 3~4+ years directly in Foundry Relationship Management, ASIC Technical Program Management, or Physical Design Implementation.
- Advanced Node Expertise: Proven hands-on track record of delivering tapeouts in sub-8nm advanced process nodes. Direct experience with Samsung Foundry ecosystems and tapeout flows is strongly preferred.
- Technical Depth: Solid understanding of PDKs, design rules, third-party IP licensing (PCIe, CXL, LPDDR, SerDes, etc.), and EDA sign-off flows (DRC/LVS/STA).
- Communication & Leadership: Strong negotiation skills and fluency in both English and Korean to communicate effectively with internal leadership and external foundry stakeholders.
